Inventor · disambiguated record
Chi-Chun Hsieh
Also filed as: HSIEH CHI-CHUN
10 granted patents·3 pending applications·38 citations·filing 2005–2025
86Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD4TAIWAN SEMICONDUCTOR MFG3HSIEH CHI-CHUN1KO FRANCIS1LIN KING-FU1
Top patents by PatentIndex Score
13 records- 0189US8872345B2Forming grounded through-silicon vias in a semiconductor substrateHSIEH CHI-CHUN·Filed 2011·Granted Oct 28, 2014·14 cites·35 claims
- 0279US8693163B2Cylindrical embedded capacitorsSU AN-JHIH·Filed 2010·Granted Apr 8, 2014·6 cites·15 claims
- 0377US8294264B2Radiate under-bump metallization structure for semiconductor devicesWANG TZU-YU·Filed 2010·Granted Oct 23, 2012·5 cites·12 claims
- 0476US2025343170A1Package connectors in semiconductor packages and methods of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0572US8716867B2Forming interconnect structures using pre-ink-printed sheetsKO FRANCIS·Filed 2010·Granted May 6, 2014·3 cites·19 claims
- 0671US7851234B2System and method for enhanced control of copper trench sheet resistance uniformityTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Dec 14, 2010·4 cites·14 claims
- 0770US9691840B2Cylindrical embedded capacitorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jun 27, 2017·2 cites·20 claims
- 0870US2025046734A1Package connectors in semicondcutor packages and methods of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0969US7767471B2Auto routing for optimal uniformity controlTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Aug 3, 2010·3 cites·15 claims
- 1063US9159673B2Forming interconnect structures using pre-ink-printed sheetsTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Oct 13, 2015·1 cites·19 claims
- 1156US11225113B2Unique ID electronic tag for tireMUTUAL PAK TECH CO LTD·Filed 2019·Granted Jan 18, 2022·0 cites·17 claims
- 1251USRE47709EForming grounded through-silicon vias in a semiconductor substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 5, 2019·0 cites·74 claims
- 1332US2007120113A1Supramolecular structures and method for forming the sameLIN KING-FU·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →