Inventor · disambiguated record
Hideaki Hayakawa
Also filed as: HAYAKAWA HIDEAKI
10 granted patents·1 pending application·360 citations·filing 1992–2011
91Inventor score
Top patents by PatentIndex Score
11 records- 0190US5498565AMethod of forming trench isolation having polishing step and method of manufacturing semiconductor deviceSONY CORP·Filed 1992·Granted Mar 12, 1996·137 cites·2 claims
- 0286US5254171ABias ECR plasma CVD apparatus comprising susceptor, clamp, and chamber wall heating and cooling meansSONY CORP·Filed 1992·Granted Oct 19, 1993·52 cites·5 claims
- 0383US5779520AMethod and apparatus of polishing waferSONY CORP·Filed 1997·Granted Jul 14, 1998·76 cites·8 claims
- 0472US5681212APolishing device and correcting method thereforSONY CORP·Filed 1996·Granted Oct 28, 1997·27 cites·5 claims
- 0567US6077155APolishing device and correcting method thereforSONY CORP·Filed 1997·Granted Jun 20, 2000·22 cites·2 claims
- 0662US5502008AMethod for forming metal plug and/or wiring metal layerSONY CORP·Filed 1994·Granted Mar 26, 1996·30 cites·2 claims
- 0753US7572995B2Switch member and power window switch disposed with the switch memberTOKAI RIKA CO LTD·Filed 2006·Granted Aug 11, 2009·2 cites·16 claims
- 0844US6126511APolishing device and correcting method thereforSONY CORP·Filed 1999·Granted Oct 3, 2000·8 cites·2 claims
- 0938US9234575B2Shift switching deviceKATO DAISUKE·Filed 2011·Granted Jan 12, 2016·0 cites·18 claims
- 1037USRE38363EMethod of forming trench isolation having polishing step and method of manufacturing semiconductor deviceSONY CORP·Filed 1998·Granted Dec 23, 2003·6 cites·2 claims
- 1127US2003119322A1Method of producing semiconductor device and processing conditions setting deviceFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →