Inventor · disambiguated record
Risto Tuominen
Also filed as: TUOMINEN RISTO · TUOMINEN RISTO ILKKA · TUOMINEN RISTO ILKKA SAKARI
59 granted patents·13 pending applications·560 citations·filing 2003–2023
98Inventor score
Files withGEN ELECTRIC22TUOMINEN RISTO16IMBERA ELECTRONICS OY13GE EMBEDDED ELECTRONICS OY7IMBERATEK LLC6
Top patents by PatentIndex Score
72 records- 0198US9363898B2Method for manufacturing an electronic module and an electronic moduleTUOMINEN RISTO·Filed 2015·Granted Jun 7, 2016·35 cites·14 claims
- 0298US8704359B2Method for manufacturing an electronic module and an electronic moduleTUOMINEN RISTO·Filed 2011·Granted Apr 22, 2014·43 cites·22 claims
- 0396US7609527B2Electronic moduleIMBERA ELECTRONICS OY·Filed 2007·Granted Oct 27, 2009·27 cites·27 claims
- 0495US7989944B2Method for embedding a component in a baseIMBERA ELECTRONICS OY·Filed 2007·Granted Aug 2, 2011·29 cites·36 claims
- 0594US7294529B2Method for embedding a component in a baseIMBERA ELECTRONICS OY·Filed 2003·Granted Nov 13, 2007·65 cites·37 claims
- 0694US6991966B2Method for embedding a component in a base and forming a contactIMBERA ELECTRONICS OY·Filed 2003·Granted Jan 31, 2006·96 cites·21 claims
- 0792US8368201B2Method for embedding a component in a baseIMBERA ELECTRONICS OY·Filed 2011·Granted Feb 5, 2013·10 cites·1 claims
- 0892US8062537B2Method for manufacturing an electronics moduleTUOMINEN RISTO·Filed 2005·Granted Nov 22, 2011·28 cites·11 claims
- 0991US7673387B2Manufacture of a layer including a componentIMBERA ELECTRONICS OY·Filed 2005·Granted Mar 9, 2010·22 cites·20 claims
- 1090US8581109B2Method for manufacturing a circuit board structureTUOMINEN RISTO·Filed 2006·Granted Nov 12, 2013·14 cites·19 claims
- 1189US7719851B2Electronics module and method for manufacturing the sameIMBERA ELECTRONICS OY·Filed 2005·Granted May 18, 2010·17 cites·8 claims
- 1288US9966361B1Electronics package having a multi-thickness conductor layer and method of manufacturing thereofGEN ELECTRIC·Filed 2016·Granted May 8, 2018·5 cites·24 claims
- 1387US7663215B2Electronic module with a conductive-pattern layer and a method of manufacturing sameIMBERA ELECTRONICS OY·Filed 2004·Granted Feb 16, 2010·41 cites·14 claims
- 1486US9966371B1Electronics package having a multi-thickness conductor layer and method of manufacturing thereofGEN ELECTRIC·Filed 2016·Granted May 8, 2018·4 cites·21 claims
- 1585US8455994B2Electronic module with feed through conductor between wiring patternsIIHOLA ANTTI·Filed 2010·Granted Jun 4, 2013·8 cites·18 claims
- 1685US7732909B2Method for embedding a component in a baseIMBERA ELECTRONICS OY·Filed 2007·Granted Jun 8, 2010·9 cites·33 claims
- 1785US7299546B2Method for manufacturing an electronic moduleIMBERA ELECTRONICS OY·Filed 2004·Granted Nov 27, 2007·24 cites·19 claims
- 1884US8240032B2Method for manufacturing an electronics module comprising a component electrically connected to a conductor-pattern layerIIHOLA ANTTI·Filed 2005·Granted Aug 14, 2012·13 cites·20 claims
- 1983US8699233B2Circuit module and method of manufacturing the samePALM PETTERI·Filed 2009·Granted Apr 15, 2014·8 cites·35 claims
- 2082US9691724B2Multi-chip package and manufacturing methodGE EMBEDDED ELECTRONICS OY·Filed 2014·Granted Jun 27, 2017·4 cites·21 claims
- 2182US2023225055A1Electronic moduleIMBERATEK LLC·Filed 2023·Application pending·0 cites
- 2281US10804115B2Electronics package with integrated interconnect structure and method of manufacturing thereofGEN ELECTRIC·Filed 2017·Granted Oct 13, 2020·3 cites·24 claims
- 2380US10700035B2Stacked electronics package and method of manufacturing thereofGEN ELECTRIC·Filed 2016·Granted Jun 30, 2020·3 cites·32 claims
- 2479US8240033B2Method for manufacturing a circuit boardTUOMINEN RISTO·Filed 2006·Granted Aug 14, 2012·8 cites·21 claims
- 2576US10453786B2Power electronics package and method of manufacturing thereofGEN ELECTRIC·Filed 2016·Granted Oct 22, 2019·2 cites·16 claims
- 2676US8487194B2Circuit board including an embedded componentTUOMINEN RISTO·Filed 2010·Granted Jul 16, 2013·4 cites·20 claims
- 2776US8076586B2Heat conduction from an embedded componentTUOMINEN RISTO·Filed 2005·Granted Dec 13, 2011·7 cites·19 claims
- 2876US8034658B2Electronic module with a conductive-pattern layer and a method of manufacturing sameIMBERA ELECTRONICS OY·Filed 2009·Granted Oct 11, 2011·5 cites·26 claims
- 2975US8547701B2Electronics module and method for manufacturing the sameTUOMINEN RISTO·Filed 2005·Granted Oct 1, 2013·7 cites·21 claims
- 3075US2021321520A1Electronic moduleIMBERATEK LLC·Filed 2021·Application pending·0 cites
- 3174US11792941B2Circuit board structure and method for manufacturing a circuit board structureIMBERATEK LLC·Filed 2021·Granted Oct 17, 2023·0 cites·17 claims
- 3274US11071207B2Electronic moduleIMBERATEK LLC·Filed 2020·Granted Jul 20, 2021·0 cites·6 claims
- 3374US10332832B2Method of manufacturing an electronics package using device-last or device-almost last placementGEN ELECTRIC·Filed 2017·Granted Jun 25, 2019·2 cites·21 claims
- 3473US10804116B2Electronics package with integrated interconnect structure and method of manufacturing thereofGEN ELECTRIC·Filed 2019·Granted Oct 13, 2020·1 cites·20 claims
- 3573US10085347B2Manufacture of a circuit board and circuit board containing a componentGE EMBEDDED ELECTRONICS OY·Filed 2015·Granted Sep 25, 2018·2 cites·8 claims
- 3672US10770444B2Electronics package having a multi-thickness conductor layer and method of manufacturing thereofGEN ELECTRIC·Filed 2018·Granted Sep 8, 2020·1 cites·28 claims
- 3771US10085345B2Electronic moduleGE EMBEDDED ELECTRONICS OY·Filed 2014·Granted Sep 25, 2018·1 cites·17 claims
- 3870US9883587B2Circuit module and method of manufacturing the samePALM PETTERI·Filed 2016·Granted Jan 30, 2018·1 cites·20 claims
- 3968US9999136B2Method for fabrication of an electronic module and electronic moduleGE EMBEDDED ELECTRONICS OY·Filed 2014·Granted Jun 12, 2018·2 cites·20 claims
- 4068US8225499B2Method for manufacturing a circuit board structure, and a circuit board structureTUOMINEN RISTO·Filed 2006·Granted Jul 24, 2012·3 cites·22 claims
- 4167US9107324B2Circuit module and method of manufacturing the samePALM PETTERI·Filed 2014·Granted Aug 11, 2015·1 cites·20 claims
- 4266US10312194B2Stacked electronics package and method of manufacturing thereofGEN ELECTRIC·Filed 2016·Granted Jun 4, 2019·1 cites·24 claims
- 4366US9622354B2Method for manufacturing a circuit board structureGE EMBEDDED ELECTRONICS OY·Filed 2013·Granted Apr 11, 2017·1 cites·14 claims
- 4464US10765006B2Electronic moduleIMBERATEK LLC·Filed 2018·Granted Sep 1, 2020·0 cites·34 claims
- 4564US9324647B2Circuit module and method of manufacturing the samePALM PETTERI·Filed 2015·Granted Apr 26, 2016·1 cites·20 claims
- 4663US8964409B2Electronic module with EMI protectionTUOMINEN RISTO·Filed 2010·Granted Feb 24, 2015·1 cites·20 claims
- 4761US8222723B2Electric module having a conductive pattern layerTUOMINEN RISTO·Filed 2010·Granted Jul 17, 2012·1 cites·9 claims
- 4860US10892231B2Electronics package including integrated electromagnetic interference shield and method of manufacturing thereofGEN ELECTRIC·Filed 2019·Granted Jan 12, 2021·0 cites·20 claims
- 4959US8817485B2Single-layer component packageTUOMINEN RISTO·Filed 2009·Granted Aug 26, 2014·0 cites·22 claims
- 5058US10470346B2Electronic module with EMI protectionGE EMBEDDED ELECTRONICS OY·Filed 2018·Granted Nov 5, 2019·0 cites·20 claims
Showing the top 50 of 72 patent records by PatentIndex Score.
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