Inventor · disambiguated record
Sun Ho Ha
Also filed as: HA SUN HO
7 granted patents·1 pending application·711 citations·filing 1996–2022
87Inventor score
Files withANAM SEMICONDUCTOR INC2SEMES CO LTD2AMKOR TECHNOLOGY INC1ANAM IND CO LTD1SAMSUNG ELECTRONICS CO LTD1
Top patents by PatentIndex Score
8 records- 0198US5998870AWiring structure of semiconductor device and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 1997·Granted Dec 7, 1999·485 cites·33 claims
- 0289US5767446APrinted circuit board having epoxy barrier around a throughout slot and ball grid array semiconductor packageANAM IND CO LTD·Filed 1996·Granted Jun 16, 1998·116 cites·10 claims
- 0381US6020218AMethod of manufacturing ball grid array semiconductor packageANAM SEMICONDUCTOR INC·Filed 1998·Granted Feb 1, 2000·68 cites·19 claims
- 0471US12400886B2Apparatus for transporting substrate and system for treating substrate with the apparatusSEMES CO LTD·Filed 2022·Granted Aug 26, 2025·0 cites·10 claims
- 0568US7211879B1Semiconductor package with chamfered corners and method of manufacturing the sameAMKOR TECHNOLOGY INC·Filed 2003·Granted May 1, 2007·16 cites·25 claims
- 0663US11569103B2Apparatus for transporting substrate and system for treating substrate with the apparatusSEMES CO LTD·Filed 2021·Granted Jan 31, 2023·0 cites·15 claims
- 0760US5897334AMethod for reproducing printed circuit boards for semiconductor packages including poor quality printed circuit board units and method for fabricating semiconductor packages using the reproduced printed circuit boardsANAM SEMICONDUCTOR INC·Filed 1997·Granted Apr 27, 1999·26 cites·10 claims
- 0832US2001004128A1Semiconductor package and manufacturing method thereofFiled 2000·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →