Inventor · disambiguated record
Yee Leng Low
Also filed as: LOW YEE · LOW YEE L · LOW YEE LENG
11 granted patents·2 pending applications·676 citations·filing 1997–2019
91Inventor score
Files withLUCENT TECHNOLOGIES INC5ALCATEL LUCENT USA INC2NOKIA SOLUTIONS & NETWORKS OY2AGERE SYST GUARDIAN CORP1AGERE SYSTEMS INC1
Top patents by PatentIndex Score
13 records- 0197US6297551B1Integrated circuit packages with improved EMI characteristicsAGERE SYST GUARDIAN CORP·Filed 1999·Granted Oct 2, 2001·210 cites·10 claims
- 0295US6603182B1Packaging micromechanical devicesLUCENT TECHNOLOGIES INC·Filed 2002·Granted Aug 5, 2003·144 cites·7 claims
- 0394US6154370ARecessed flip-chip packageLUCENT TECHNOLOGIES INC·Filed 1998·Granted Nov 28, 2000·117 cites·7 claims
- 0492US5898223AChip-on-chip IC packagesLUCENT TECHNOLOGIES INC·Filed 1997·Granted Apr 27, 1999·149 cites·15 claims
- 0582US7217922B2Planar micro-miniature ion trap devicesLUCENT TECHNOLOGIES INC·Filed 2005·Granted May 15, 2007·10 cites·19 claims
- 0679US6313719B1Method of tuning a planar filter with additional coupling created by bent resonator elementsAVAYA TECHNOLOGY CORP·Filed 2000·Granted Nov 6, 2001·15 cites·2 claims
- 0768US6370766B1Manufacture of printed circuit cardsLUCENT TECHNOLOGIES INC·Filed 1997·Granted Apr 16, 2002·30 cites·9 claims
- 0866US10338329B2Arrangement for connecting photonic and electronic componentsNOKIA SOLUTIONS & NETWORKS OY·Filed 2017·Granted Jul 2, 2019·1 cites·17 claims
- 0960US10830949B2Optoelectronic circuit having one or more double-sided substratesNOKIA AMERICA CORP·Filed 2019·Granted Nov 10, 2020·0 cites·10 claims
- 1055US10359565B2Optoelectronic circuit having one or more double-sided substratesALCATEL LUCENT USA INC·Filed 2017·Granted Jul 23, 2019·0 cites·11 claims
- 1142US2019312653A1Chip-in-connector photonic apparatusNOKIA SOLUTIONS & NETWORKS OY·Filed 2018·Application pending·0 cites
- 1238US2019081706A1Communication through window using free-space optical data communicationALCATEL LUCENT USA INC·Filed 2018·Application pending·0 cites
- 1330US6232047B1Fabricating high-Q RF componentsAGERE SYSTEMS INC·Filed 1999·Granted May 15, 2001·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →