Inventor · disambiguated record
Hsien-Wen Hsu
Also filed as: HSU HSIEN-WEN
19 granted patents·22 pending applications·134 citations·filing 2002–2019
93Inventor score
Files withADVANCED CHIP ENG TECH INC19POWERTECH TECHNOLOGY INC9MACRONIX INT CO LTD6TSENG CHIEN-CHUNG2HSU HSIEN-WEN1
Top patents by PatentIndex Score
41 records- 0190US8188700B2Apparatus and method for driving sensorless motorTSENG CHIEN-CHUNG·Filed 2009·Granted May 29, 2012·33 cites·9 claims
- 0289US7149121B2Method and apparatus for changing operating conditions of nonvolatile memoryMACRONIX INT CO LTD·Filed 2005·Granted Dec 12, 2006·22 cites·29 claims
- 0387US10224254B2Package process method including disposing a die within a recess of a one-piece materialPOWERTECH TECHNOLOGY INC·Filed 2017·Granted Mar 5, 2019·6 cites·20 claims
- 0485US7525185B2Semiconductor device package having multi-chips with side-by-side configuration and method of the sameADVANCED CHIP ENG TECH INC·Filed 2007·Granted Apr 28, 2009·14 cites·16 claims
- 0582US7335870B1Method for image sensor protectionADVANCED CHIP ENG TECH INC·Filed 2006·Granted Feb 26, 2008·11 cites·8 claims
- 0678US7411833B2Nitride trapping memory device and method for reading the sameMACRONIX INT CO LTD·Filed 2007·Granted Aug 12, 2008·9 cites·6 claims
- 0774US11024603B2Manufacturing method and a related stackable chip packagePOWERTECH TECHNOLOGY INC·Filed 2019·Granted Jun 1, 2021·2 cites·6 claims
- 0869US10354978B1Stacked package including exterior conductive element and a manufacturing method of the samePOWERTECH TECHNOLOGY INC·Filed 2018·Granted Jul 16, 2019·1 cites·9 claims
- 0969US7687923B2Semiconductor device package having a back side protective schemeADVANCED CHIP ENG TECH INC·Filed 2007·Granted Mar 30, 2010·4 cites·10 claims
- 1067US10892250B2Stacked package structure with encapsulation and redistribution layer and fabricating method thereofPOWERTECH TECHNOLOGY INC·Filed 2018·Granted Jan 12, 2021·1 cites·8 claims
- 1165US6580287B2Voltage-boosting generator for reducing effects due to operating voltage variation and temperature changeMACRONIX INT CO LTD·Filed 2002·Granted Jun 17, 2003·18 cites·25 claims
- 1264US7746148B2High-side driverINERGY TECHNOLOGY INC·Filed 2008·Granted Jun 29, 2010·6 cites·8 claims
- 1364US7710784B2Method of reading the bits of nitride read-only memory cellMACRONIX INT CO LTD·Filed 2008·Granted May 4, 2010·4 cites·5 claims
- 1455US2018114782A1Manufacturing method of package-on-package structurePOWERTECH TECHNOLOGY INC·Filed 2017·Application pending·0 cites
- 1553US8310190B2Apparatus and method for detecting lock error in sensorless motorHSU HSIEN-WEN·Filed 2010·Granted Nov 13, 2012·1 cites·15 claims
- 1649US2008029877A1Method for separating package of wlpADVANCED CHIP ENG TECH INC·Filed 2007·Application pending·0 cites
- 1746US2007072338A1Method for separating package of WLPADVANCED CHIP ENG TECH INC·Filed 2005·Application pending·0 cites
- 1845US2009096098A1Inter-connecting structure for semiconductor package and method of the sameADVANCED CHIP ENG TECH INC·Filed 2007·Application pending·0 cites
- 1945US2008191335A1Cmos image sensor chip scale package with die receiving opening and method of the sameADVANCED CHIP ENG TECH INC·Filed 2007·Application pending·0 cites
- 2045US2009096093A1Inter-connecting structure for semiconductor package and method of the sameADVANCED CHIP ENG TECH INC·Filed 2007·Application pending·0 cites
- 2144US2009127686A1Stacking die package structure for semiconductor devices and method of the sameADVANCED CHIP ENG TECH INC·Filed 2007·Application pending·0 cites
- 2244US2008211075A1Image sensor chip scale package having inter-adhesion with gap and method of the sameADVANCED CHIP ENG TECH INC·Filed 2007·Application pending·0 cites
- 2344US2009039532A1Semiconductor device package having a back side protective schemeADVANCED CHIP ENG TECH INC·Filed 2007·Application pending·0 cites
- 2444US2008217761A1Structure of semiconductor device package and method of the sameADVANCED CHIP ENG TECH INC·Filed 2007·Application pending·0 cites
- 2544US2020144907A1Three-Mode Selection Electronically Commuted MotorINERGY TECH INC·Filed 2019·Application pending·0 cites
- 2643US8308596B2Transmission mechanism with intermittent output movementTSAY DER-MIN·Filed 2009·Granted Nov 13, 2012·0 cites·10 claims
- 2743US2008265462A1Panel/wafer molding apparatus and method of the sameADVANCED CHIP ENG TECH INC·Filed 2007·Application pending·0 cites
- 2843US2008229574A1Self chip redistribution apparatus and method for the sameADVANCED CHIP ENG TECH INC·Filed 2007·Application pending·0 cites
- 2943US2008083980A1Cmos image sensor chip scale package with die receiving through-hole and method of the sameADVANCED CHIP ENG TECH INC·Filed 2007·Application pending·0 cites
- 3043US2008073774A1Chip package and chip package arrayADVANCED CHIP ENG TECH INC·Filed 2006·Application pending·0 cites
- 3142US2008191333A1Image sensor package with die receiving opening and method of the sameADVANCED CHIP ENG TECH INC·Filed 2007·Application pending·0 cites
- 3242US2008197478A1Semiconductor device package with die receiving through-hole and connecting through-hole and method of the sameYANG WEN-KUN·Filed 2007·Application pending·0 cites
- 3341US2008173792A1Image sensor module and the method of the sameADVANCED CHIP ENG TECH INC·Filed 2007·Application pending·0 cites
- 3440US2008197469A1Multi-chips package with reduced structure and method for forming the sameADVANCED CHIP ENG TECH INC·Filed 2007·Application pending·0 cites
- 3539US7310261B2Nitride read-only memory (NROM) device and method for reading the sameMACRONIX INT CO LTD·Filed 2006·Granted Dec 18, 2007·0 cites·5 claims
- 3638US2019252325A1Chip package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2018·Application pending·0 cites
- 3737US7262999B2System and method for preventing read margin degradation for a memory arrayMACRONIX INT CO LTD·Filed 2004·Granted Aug 28, 2007·2 cites·9 claims
- 3837US2019214367A1Stacked package and a manufacturing method of the samePOWERTECH TECHNOLOGY INC·Filed 2018·Application pending·0 cites
- 3936US9659884B2Carrier substratePOWERTECH TECHNOLOGY INC·Filed 2016·Granted May 23, 2017·0 cites·17 claims
- 4035US8269444B2System and method for controlling sensorless motorTSENG CHIEN-CHUNG·Filed 2010·Granted Sep 18, 2012·0 cites·10 claims
- 4133US2017047277A1Semiconductor structurePOWERTECH TECHNOLOGY INC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →