Inventor · disambiguated record
Dean Paul Kossives
Also filed as: KOSSIVES DEAN P · KOSSIVES DEAN PAUL
21 granted patents·2 pending applications·1,194 citations·filing 1991–2014
97Inventor score
Files withLUCENT TECHNOLOGIES INC7AGERE SYSTEMS INC5AGERE SYST GUARDIAN CORP3STATS CHIPPAC LTD3AT & T BELL LAB1
Top patents by PatentIndex Score
23 records- 0198US6255714B1Integrated circuit having a micromagnetic device including a ferromagnetic core and method of manufacture thereforAGERE SYST GUARDIAN CORP·Filed 1999·Granted Jul 3, 2001·254 cites·26 claims
- 0297US6297551B1Integrated circuit packages with improved EMI characteristicsAGERE SYST GUARDIAN CORP·Filed 1999·Granted Oct 2, 2001·210 cites·10 claims
- 0395US7733661B2Chip carrier and fabrication methodSTATS CHIPPAC LTD·Filed 2009·Granted Jun 8, 2010·27 cites·14 claims
- 0495US6440750B1Method of making integrated circuit having a micromagnetic deviceAGERE SYST GUARDIAN CORP·Filed 2000·Granted Aug 27, 2002·102 cites·10 claims
- 0595US6118351AMicromagnetic device for power processing applications and method of manufacture thereforLUCENT TECHNOLOGIES INC·Filed 1997·Granted Sep 12, 2000·137 cites·40 claims
- 0694US6160721AMicromagnetic device for power processing applications and method of manufacture thereforLUCENT TECHNOLOGIES INC·Filed 2000·Granted Dec 12, 2000·73 cites·20 claims
- 0791US7021518B2Micromagnetic device for power processing applications and method of manufacture thereforAGERE SYSTEMS INC·Filed 2003·Granted Apr 4, 2006·49 cites·18 claims
- 0890US6649422B2Integrated circuit having a micromagnetic device and method of manufacture thereforAGERE SYSTEMS INC·Filed 2001·Granted Nov 18, 2003·50 cites·18 claims
- 0986US6232212B1Flip chip bump bondingLUCENT TECHNOLOGIES INC·Filed 1999·Granted May 15, 2001·86 cites·15 claims
- 1082US6191495B1Micromagnetic device having an anisotropic ferromagnetic core and method of manufacture thereforLUCENT TECHNOLOGIES INC·Filed 1999·Granted Feb 20, 2001·62 cites·19 claims
- 1168US6696744B2Integrated circuit having a micromagnetic device and method of manufacture thereforAGERE SYSTEMS INC·Filed 2001·Granted Feb 24, 2004·12 cites·9 claims
- 1268US6370766B1Manufacture of printed circuit cardsLUCENT TECHNOLOGIES INC·Filed 1997·Granted Apr 16, 2002·30 cites·9 claims
- 1357US6163234AMicromagnetic device for data transmission applications and method of manufacture thereforLUCENT TECHNOLOGIES INC·Filed 1998·Granted Dec 19, 2000·15 cites·13 claims
- 1456US7525812B2Chip carrier and fabrication methodSTATS CHIPPAC LTD·Filed 2007·Granted Apr 28, 2009·0 cites·16 claims
- 1556US5125560AMethod of soldering including removal of flux residueAT & T BELL LAB·Filed 1991·Granted Jun 30, 1992·24 cites·6 claims
- 1655US6683384B1Air isolated crossoversAGERE SYSTEMS INC·Filed 1997·Granted Jan 27, 2004·20 cites·10 claims
- 1755US5516728AProcess for fabircating an integrated circuitAT & T CORP·Filed 1994·Granted May 14, 1996·24 cites·23 claims
- 1854US7091469B2Packaging for optoelectronic devicesST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Aug 15, 2006·6 cites·20 claims
- 1954US2014303043A1Reversible reaction sensors and assembliesCLEAR ALIGN LLC·Filed 2014·Application pending·0 cites
- 2053US7304859B2Chip carrier and fabrication methodSTATS CHIPPAC LTD·Filed 2006·Granted Dec 4, 2007·0 cites·6 claims
- 2151US2011171084A1Reversible reaction sensors and assembliesKOSSIVES DEAN PAUL·Filed 2010·Application pending·0 cites
- 2248US5778913ACleaning solder-bonded flip-chip assembliesLUCENT TECHNOLOGIES INC·Filed 1997·Granted Jul 14, 1998·13 cites·7 claims
- 2325US6560735B1Methods and apparatus for testing integrated circuitsAGERE SYSTEMS INC·Filed 1999·Granted May 6, 2003·0 cites·14 claims
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