Inventor · disambiguated record
Seiichi Akagi
Also filed as: AKAGI SEIICHI
4 granted patents·4 pending applications·55 citations·filing 1997–2006
77Inventor score
Top patents by PatentIndex Score
8 records- 0185US7846998B2Sealant epoxy-resin molding material, and electronic component deviceHITACHI CHEMICAL CO LTD·Filed 2005·Granted Dec 7, 2010·23 cites·26 claims
- 0272US6713589B2Phenyl, naphthly or fluorene cyclopentyl epoxy resinsHITACHI CHEMICAL CO LTD·Filed 2001·Granted Mar 30, 2004·17 cites·17 claims
- 0344US2008039556A1Encapsulated Epoxy-Resin Molding Compound, And Electronic Component DeviceHITACHI CHEMICAL CO LTD·Filed 2005·Application pending·0 cites
- 0439US6207789B1Phenolic resin, resin composition, molding material for encapsulation, and electronic component deviceHITACHI CHEMICAL CO LTD·Filed 1998·Granted Mar 27, 2001·9 cites·20 claims
- 0537US6329492B1Phenyl, naphthyl or fluorene cyclopentyl epoxy resinsHITACHI CHEMICAL CO LTD·Filed 1997·Granted Dec 11, 2001·6 cites·15 claims
- 0637US2009062430A1Epoxy Resin Composition for Sealing and Electronic Component DeviceIKEZAWA RYOICHI·Filed 2006·Application pending·0 cites
- 0736US2009143511A1Encapsulated epoxy-resin molding compound, and electronic component deviceHITACHI CHEMICAL CO LTD·Filed 2005·Application pending·0 cites
- 0836US2009137717A1Encapsulated epoxy resin composition and electronic component deviceIKEZAWA RYOICHI·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →