Inventor · disambiguated record
Tsun-Jen Chan
Also filed as: CHAN TSUN-JEN
9 granted patents·1 pending application·12 citations·filing 2011–2025
80Inventor score
Top patents by PatentIndex Score
10 records- 0190US9099495B1Formation of high quality fin in 3D structure by way of two-step implantationTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Aug 4, 2015·8 cites·20 claims
- 0276US2025359183A1Semiconductor device and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0368US12432977B2Semiconductor device and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 30, 2025·0 cites·20 claims
- 0466US9982338B2High-throughput system and method for post-implantation single wafer warm-upTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 29, 2018·1 cites·20 claims
- 0559US10522427B2Techniques providing semiconductor wafer grouping in a feed forward processCHAN TSUN JEN·Filed 2011·Granted Dec 31, 2019·3 cites·20 claims
- 0656US9634126B2Formation of high quality Fin in 3D structure by way of two-step implantationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 25, 2017·0 cites·20 claims
- 0754US9425290B2Formation of high quality fin in 3D structure by way of two-step implantationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 23, 2016·0 cites·20 claims
- 0851US9343312B2High temperature intermittent ion implantationTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted May 17, 2016·0 cites·20 claims
- 0949US9663854B2High-throughput system and method for post-implantation single wafer warm-upTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted May 30, 2017·0 cites·23 claims
- 1048US10049856B2High temperature intermittent ion implantationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 14, 2018·0 cites·20 claims
Join the waitlist — get patent alerts
Get an alert when Tsun-Jen Chan files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →