Inventor · disambiguated record
Kun-Dae Yeom
Also filed as: YEOM KUN-DAE
11 granted patents·10 pending applications·238 citations·filing 2004–2019
89Inventor score
Top patents by PatentIndex Score
21 records- 0196US8723333B2Semiconductor package including multiple chips and separate groups of leadsPARK CHUL·Filed 2012·Granted May 13, 2014·43 cites·23 claims
- 0295US7391105B2Unit semiconductor chip and multi chip package with center bonding pads and methods for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Jun 24, 2008·161 cites·9 claims
- 0392US8901750B2Semiconductor package including multiple chips and separate groups of leadsSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Dec 2, 2014·12 cites·20 claims
- 0490US8664757B2High density chip stacked package, package-on-package and method of fabricating the sameCHO YUN-RAE·Filed 2011·Granted Mar 4, 2014·14 cites·17 claims
- 0570US8193626B2Semiconductor package including multiple chips and separate groups of leadsPARK CHUL·Filed 2009·Granted Jun 5, 2012·3 cites·14 claims
- 0668US10607905B2Package substrate for a semiconductor package having landing pads extending toward a through-hole in a chip mounting regionSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 31, 2020·1 cites·20 claims
- 0764US10361135B2Semiconductor package including landing pads extending at an oblique angle toward a through-hole in the package substrateSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jul 23, 2019·1 cites·20 claims
- 0860US7759795B2Printed circuit board having reliable bump interconnection structure, method of fabricating the same, and semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jul 20, 2010·2 cites·15 claims
- 0959US7521289B2Package having dummy package substrate and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Apr 21, 2009·1 cites·14 claims
- 1057US9455217B2Semiconductor package including multiple chips and separate groups of leadsSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Sep 27, 2016·0 cites·20 claims
- 1145US2009057916A1Semiconductor package and apparatus using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 1245US2008308913A1Stacked semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 1345US2008122081A1Method of fabricating electronic device having sacrificial anode, and electronic device fabricated by the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 1445US2009026596A1Lead frame, semiconductor package, and stacked semiconductor package having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 1544US2006049501A1Package having dummy package substrate and method of fabricating the sameLEE YOUNG-MIN·Filed 2005·Application pending·0 cites
- 1643US2008315379A1Semiconductor packages including thermal stress buffers and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 1740US9041181B2Land grid array package capable of decreasing a height difference between a land and a solder resistLEE HEE-CHUL·Filed 2011·Granted May 26, 2015·0 cites·13 claims
- 1840US2008017968A1Stack type semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 1940US2013161836A1Semiconductor package having interposer comprising a plurality of segmentsYEOM KUN-DAE·Filed 2012·Application pending·0 cites
- 2038US2011304056A1Stack-type semiconductor package and method of manufacturing the sameLEE DONG-HUN·Filed 2011·Application pending·0 cites
- 2136US2010314740A1Semiconductor package, stack module, card, and electronic systemSAMSUNG ELECTRONICS CO LTD·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →