Inventor · disambiguated record
Takuji Okeyui
Also filed as: OKEYUI TAKUJI
15 granted patents·8 pending applications·231 citations·filing 1999–2013
93Inventor score
Top patents by PatentIndex Score
23 records- 0191US7262514B2Epoxy resin composition for semiconductor encapsulation, semiconductor device using the same, and process for producing semiconductor deviceNITTO DENKO CORP·Filed 2005·Granted Aug 28, 2007·25 cites·8 claims
- 0291US6373000B2Double-sided circuit board and multilayer wiring board comprising the same and process for producing double-sided circuit boardNITTO DENKO CORP·Filed 2000·Granted Apr 16, 2002·55 cites·11 claims
- 0388US7235888B2Method for manufacturing semiconductor device, adhesive sheet for use therein and semiconductor deviceNITTO DENKO CORP·Filed 2005·Granted Jun 26, 2007·15 cites·13 claims
- 0484US7365441B2Semiconductor device fabricating apparatus and semiconductor device fabricating methodDAINIPPON PRINTING CO LTD·Filed 2006·Granted Apr 29, 2008·15 cites·3 claims
- 0582US6335076B1Multi-layer wiring board and method for manufacturing the sameNITTO DENKO CORP·Filed 2000·Granted Jan 1, 2002·26 cites·5 claims
- 0676US7064011B2Semiconductor device fabricating apparatus and semiconductor device fabricating methodNITTO DENKO CORP·Filed 2004·Granted Jun 20, 2006·21 cites·9 claims
- 0768US6333469B1Wafer-scale package structure and circuit board attached theretoNITTO DENKO CORP·Filed 1999·Granted Dec 25, 2001·34 cites·14 claims
- 0865US8018044B2Semiconductor device, substrate for producing semiconductor device and method of producing themDAINIPPON PRINTING CO LTD·Filed 2005·Granted Sep 13, 2011·3 cites·6 claims
- 0964US6858473B2Method for manufacturing semiconductor device, adhesive sheet for use therein and semiconductor deviceNITTO DENKO CORP·Filed 2003·Granted Feb 22, 2005·12 cites·14 claims
- 1063US7132755B2Adhesive film for manufacturing semiconductor deviceNITTO DENKO CORP·Filed 2004·Granted Nov 7, 2006·11 cites·9 claims
- 1154US6245188B1Process for the removal of resist materialNITTO DENKO CORP·Filed 1999·Granted Jun 12, 2001·12 cites·6 claims
- 1253US2013243605A1Protecting film for blade of wind power generatorNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 1349US7862954B2Fuel cellAQUAFAIRY CORP·Filed 2004·Granted Jan 4, 2011·2 cites·19 claims
- 1448US2011058950A1Protecting film for blade of wind power generatorNITTO DENKO CORP·Filed 2010·Application pending·0 cites
- 1546US2011031758A1Reinforcing sheet for wind power generator blades, reinforcing structure of wind power generator blade, wind power generator, method for reinforcing the wind power generator bladeNITTO DENKO CORP·Filed 2010·Application pending·0 cites
- 1644US8525351B2Semiconductor device, substrate for producing semiconductor device and method of producing themIKENAGA CHIKAO·Filed 2011·Granted Sep 3, 2013·0 cites·6 claims
- 1742US2003219608A1Metal transfer sheet, producing method thereof, and producing method of ceramic condenserFiled 2003·Application pending·0 cites
- 1841US2011031759A1Foam filling material for wind power generator blades, foam filling member for wind power generator blades, wind power generator blade, wind power generator, and method for producing the wind power generator bladeNITTO DENKO CORP·Filed 2010·Application pending·0 cites
- 1940US6565704B2Process for the removal of resist materialNITTO DENKO CORP·Filed 2001·Granted May 20, 2003·0 cites·10 claims
- 2040US2008248338A1Fuel Cell and Power Generating MethodYANO MASAYA·Filed 2005·Application pending·0 cites
- 2139US7943427B2Semiconductor device, substrate for producing semiconductor device and method of producing themDAINIPPON PRINTING CO LTD·Filed 2005·Granted May 17, 2011·0 cites·3 claims
- 2237US2011031757A1Vibration damping sheet for wind power generator blades, vibration damping structure of wind power generator blade, wind power generator, and method for damping vibration of wind power generator bladeNITTO DENKO CORP·Filed 2010·Application pending·0 cites
- 2337US2005030696A1Thin metal layers-having ceramic green sheet and method for producing ceramic capacitorNITTO DENKO CORP·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →