Inventor · disambiguated record
Chih-Liang Hu
Also filed as: HU CHIH-LIANG
8 granted patents·1 pending application·11 citations·filing 2003–2019
76Inventor score
Top patents by PatentIndex Score
9 records- 0154US6870261B2Discrete circuit component having an up-right circuit die with lateral electrical connectionsCOMCHIP TECHNOLOGY CO LTD·Filed 2003·Granted Mar 22, 2005·10 cites·17 claims
- 0248US10600703B2Process for packaging circuit component having copper circuits with solid electrical and thermal conductivities and circuit component thereofHU CHIH LIANG·Filed 2019·Granted Mar 24, 2020·0 cites·1 claims
- 0343US10256116B2Process for packaging circuit component having copper circuits with solid electrical and thermal conductivities and circuit component thereofHU CHIH LIANG·Filed 2017·Granted Apr 9, 2019·0 cites·5 claims
- 0439US6818541B2Metal bonding method for semiconductor circuit components employing prescribed feeds of metal ballsCOMCHIP TECHNOLOGY CO LTD·Filed 2003·Granted Nov 16, 2004·1 cites·9 claims
- 0533US6989559B2Discrete circuit component having fabrication stage clogged through-holes and process of making the sameCOMCHIP TECHNOLOGY CO LTD·Filed 2003·Granted Jan 24, 2006·0 cites·11 claims
- 0633US2004183196A1[metal bonding method for semiconductor circuit components employing prescribed feeds of metal balls]Filed 2003·Application pending·0 cites
- 0730US9515047B2High performance package and process for makingHU CHIH-LIANG·Filed 2015·Granted Dec 6, 2016·0 cites·9 claims
- 0828US9735138B2Integrated circuit package and method of making the sameHU CHIH-LIANG·Filed 2015·Granted Aug 15, 2017·0 cites·3 claims
- 0927US11521862B2Process for fabricating circuit components in matrix batchesHU CHIH LIANG·Filed 2018·Granted Dec 6, 2022·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →