Inventor · disambiguated record
Sven Walczyk
Also filed as: WALCZYK SVEN
7 granted patents·6 pending applications·14 citations·filing 1997–2024
77Inventor score
Top patents by PatentIndex Score
13 records- 0180US9847283B1Semiconductor device with wettable corner leadsNexperia BV·Filed 2016·Granted Dec 19, 2017·6 cites·14 claims
- 0275US11227820B2Through hole side wettable flankNexperia BV·Filed 2020·Granted Jan 18, 2022·1 cites·20 claims
- 0361US10262926B2Reversible semiconductor dieNexperia BV·Filed 2016·Granted Apr 16, 2019·1 cites·13 claims
- 0456US2025006597A1Semiconductor device as well as a method for manufacturing such semiconductor deviceNexperia BV·Filed 2024·Application pending·0 cites
- 0549US8981566B2Discrete semiconductor device package and manufacturing methodNXP BV·Filed 2013·Granted Mar 17, 2015·0 cites·9 claims
- 0646US9263335B2Discrete semiconductor device package and manufacturing methodNXP BV·Filed 2015·Granted Feb 16, 2016·0 cites·7 claims
- 0736US2013334695A1Electronic device and method of manufacturing such deviceNXP BV·Filed 2013·Application pending·0 cites
- 0835US2012286399A1Leadframe and method for packaging semiconductor dieBOETTCHER TIM·Filed 2012·Application pending·0 cites
- 0933US5812715AOptoelectronic device with a coupling between a semiconductor diode laser modulator or amplifier and two optical glass fibersPHILIPS CORP·Filed 1997·Granted Sep 22, 1998·6 cites·10 claims
- 1032US2012112351A1Semiconductor device packaging method and semiconductor device packageWALCZYK SVEN·Filed 2011·Application pending·0 cites
- 1131US8508035B2Circuit connector apparatus and method thereforGROENHUIS ROELF ANCO JACOB·Filed 2011·Granted Aug 13, 2013·0 cites·15 claims
- 1230US2012286410A1Semiconductor device packaging method and semiconductor device packageGROENHUIS ROELF ANCO JACOB·Filed 2011·Application pending·0 cites
- 1322US2016005710A1Methods of attaching electronic componentsNXP BV·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →