Inventor · disambiguated record
Ryuichiro Mori
Also filed as: MORI RYUICHIRO
10 granted patents·940 citations·filing 1987–1998
92Inventor score
Files withMITSUBISHI ELECTRIC CORP10
Top patents by PatentIndex Score
10 records- 0196US5903049ASemiconductor module comprising semiconductor packagesMITSUBISHI ELECTRIC CORP·Filed 1998·Granted May 11, 1999·267 cites·3 claims
- 0295US4942454AResin sealed semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1988·Granted Jul 17, 1990·257 cites·3 claims
- 0394US6369447B2Plastic-packaged semiconductor device including a plurality of chipsMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Apr 9, 2002·206 cites·6 claims
- 0486US5139969AMethod of making resin molded semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1991·Granted Aug 18, 1992·96 cites·5 claims
- 0573US4884124AResin-encapsulated semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1987·Granted Nov 28, 1989·44 cites·8 claims
- 0655US4857989ASemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1987·Granted Aug 15, 1989·21 cites·10 claims
- 0754US6163070ASemiconductor package utilizing a flexible wiring substrateMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Dec 19, 2000·20 cites·6 claims
- 0851US5659199AResin sealed semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Aug 19, 1997·17 cites·8 claims
- 0939US4878610ADie bonding apparatusMITSUBISHI ELECTRIC CORP·Filed 1989·Granted Nov 7, 1989·10 cites·9 claims
- 1029US5042123AComputer controlled automated semiconductor production apparatusMITSUBISHI ELECTRIC CORP·Filed 1989·Granted Aug 27, 1991·2 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →