Inventor · disambiguated record
Kirill Trunov
Also filed as: TRUNOV KIRILL
8 granted patents·1 pending application·7 citations·filing 2011–2023
76Inventor score
Technology areasH10W
Top patents by PatentIndex Score
9 records- 0186US11798924B2Batch soldering of different elements in power moduleINFINEON TECHNOLOGIES AG·Filed 2020·Granted Oct 24, 2023·3 cites·19 claims
- 0272US12166005B2Semiconductor device having a soldered joint with one or more intermetallic phasesINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2022·Granted Dec 10, 2024·0 cites·17 claims
- 0368US8736052B2Semiconductor device including diffusion soldered layer on sintered silver layerOESCHLER NIELS·Filed 2011·Granted May 27, 2014·4 cites·22 claims
- 0465US12394769B2Batch soldering of different elements in power moduleINFINEON TECHNOLOGIES AG·Filed 2023·Granted Aug 19, 2025·0 cites·19 claims
- 0560US2021375824A1Electronic device having a soldered joint between a metal region of a semiconductor die and a metal region of a substrateINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2021·Application pending·0 cites
- 0657US11605608B2Preform diffusion solderingINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2019·Granted Mar 14, 2023·0 cites·18 claims
- 0756US11158602B2Batch diffusion soldering and electronic devices produced by batch diffusion solderingINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2019·Granted Oct 26, 2021·0 cites·18 claims
- 0849US11764185B2Diffusion soldering preform with varying surface profileINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2021·Granted Sep 19, 2023·0 cites·14 claims
- 0941US9741639B2Semiconductor chip, method for producing a semiconductor chip and method for soldering a semiconductor chip to a carrierINFINEON TECHNOLOGIES AG·Filed 2013·Granted Aug 22, 2017·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →