Inventor · disambiguated record
Kao-Feng Liao
Also filed as: LIAO KAO-FENG
17 granted patents·4 pending applications·433 citations·filing 2004–2025
90Inventor score
Top patents by PatentIndex Score
21 records- 0197US7202512B2Construction of thin strain-relaxed SiGe layers and method for fabricating the sameIND TECH RES INST·Filed 2004·Granted Apr 10, 2007·417 cites·13 claims
- 0290US11145751B2Semiconductor structure with doped contact plug and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 12, 2021·6 cites·20 claims
- 0388US9281192B2CMP-friendly coatings for planar recessing or removing of variable-height layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Mar 8, 2016·7 cites·20 claims
- 0486US11679469B2Chemical mechanical planarization toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 20, 2023·2 cites·18 claims
- 0584US12249542B2Semiconductor device structure with an interconnect structure in a dielectric layer with multiple hydrophobic layers along sidewalls of the dielectric layer, and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 11, 2025·0 cites·20 claims
- 0683US12172263B2Chemical mechanical planarization toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 24, 2024·0 cites·20 claims
- 0782US2025308928A1Chemical mechanical polishing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0879US2024395562A1Chemical mechanical polish slurry and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0978US12300508B2Chemical mechanical polishing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 13, 2025·0 cites·20 claims
- 1078US11854872B2Semiconductor device structure with interconnect structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·20 claims
- 1177US2025313723A1Composition and method for polishing and integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1272US12327734B2Chemical mechanical polish slurry and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 10, 2025·0 cites·20 claims
- 1371US11373879B2Chemical mechanical polishing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 28, 2022·0 cites·20 claims
- 1466US12359090B2Composition and method for polishing and integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 15, 2025·0 cites·20 claims
- 1564US11189727B2FinFET contacts and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 30, 2021·1 cites·20 claims
- 1662US11417566B2Semiconductor device structure with interconnect structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 16, 2022·0 cites·20 claims
- 1761US11043396B2Chemical mechanical polish slurry and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 22, 2021·0 cites·20 claims
- 1861US10777423B2Chemical mechanical polishing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 15, 2020·0 cites·20 claims
- 1956US12297375B2Slurry composition and method for polishing and integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 13, 2025·0 cites·20 claims
- 2056US2024391049A1Semiconductor processing tool and methods of operationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2148US9337066B2Wafer cleaning moduleTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted May 10, 2016·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →