Inventor · disambiguated record
Shigeru Danjo
Also filed as: DANJO SHIGERU
5 granted patents·6 pending applications·100 citations·filing 1986–2006
82Inventor score
Top patents by PatentIndex Score
11 records- 0191US6451441B1Film with metal foilKYOCERA CORP·Filed 2000·Granted Sep 17, 2002·45 cites·8 claims
- 0276US6939741B2IC chip manufacturing methodDISCO CORP·Filed 2003·Granted Sep 6, 2005·22 cites·6 claims
- 0372US7335578B2Method for manufacturing semiconductor chipSEKISUI CHEMICAL CO LTD·Filed 2003·Granted Feb 26, 2008·17 cites·16 claims
- 0463US6866739B2Film with metal foilKYOCERA CORP·Filed 2002·Granted Mar 15, 2005·3 cites·12 claims
- 0557US2006269715A1Adhesive material, method for peeling adhesive material, and pressure-sensitive adhesive tapeSEKISUI CHEMICAL CO LTD·Filed 2006·Application pending·0 cites
- 0649US4756994APhotocurable resin composition having excellent adhesion to the surface of a substrateSEIKISUI CHEMICAL CO LTD·Filed 1986·Granted Jul 12, 1988·13 cites·10 claims
- 0747US2005173051A1Adhesive material, method for peeling adhesive material, and pressure-sensitive adhesive tapeFiled 2002·Application pending·0 cites
- 0842US2005054758A1Adhesive substance, adhesive product, and connected structureFiled 2002·Application pending·0 cites
- 0939US2004261943A1Adhesive material, method for unsticking adhesive material and bound structureFUKUOKA MASATERU·Filed 2002·Application pending·0 cites
- 1035US2008314507A1Ic Chip Manufacturing MethodHATAI MUNEHIRO·Filed 2004·Application pending·0 cites
- 1133US2004248382A1Pressure sensitive adhesive double coated tape and method for producing ic chip using itFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →