Inventor · disambiguated record
Nina G. Chechik
Also filed as: CHECHIK NINA G
10 granted patents·1 pending application·563 citations·filing 1998–2001
93Inventor score
Files withRODEL INC10
Top patents by PatentIndex Score
11 records- 0194US6488570B1Method relating to a polishing system having a multi-phase polishing layerRODEL INC·Filed 2000·Granted Dec 3, 2002·68 cites·8 claims
- 0293US6210254B1Method of manufacturing a polymeric polishing pad having photolithographically induced surface pattern(s)RODEL INC·Filed 2000·Granted Apr 3, 2001·45 cites·1 claims
- 0392US6069080AFixed abrasive polishing system for the manufacture of semiconductor devices, memory disks and the likeRODEL INC·Filed 1998·Granted May 30, 2000·126 cites·37 claims
- 0490US6337281B1Fixed abrasive polishing system for the manufacture of semiconductor devices, memory disks and the likeRODEL INC·Filed 2000·Granted Jan 8, 2002·44 cites·31 claims
- 0590US6036579APolymeric polishing pad having photolithographically induced surface patterns(s) and methods relating theretoRODEL INC·Filed 1998·Granted Mar 14, 2000·82 cites·15 claims
- 0689US6099394APolishing system having a multi-phase polishing substrate and methods relating theretoRODEL INC·Filed 1998·Granted Aug 8, 2000·82 cites·13 claims
- 0785US6375559B1Polishing system having a multi-phase polishing substrate and methods relating theretoRODEL INC·Filed 1999·Granted Apr 23, 2002·61 cites·14 claims
- 0882US6284114B1Method of fabricating a porous polymeric material by electrophoretic depositionRODEL INC·Filed 2000·Granted Sep 4, 2001·28 cites·15 claims
- 0976US6210525B1Apparatus and methods for chemical-mechanical polishing of semiconductor wafersRODEL INC·Filed 2000·Granted Apr 3, 2001·14 cites·10 claims
- 1070US6245679B1Apparatus and methods for chemical-mechanical polishing of semiconductor wafersRODEL INC·Filed 2000·Granted Jun 12, 2001·13 cites·28 claims
- 1140US2002020495A1Apparatus and methods for chemical-mechanical polishing of semiconductor wafersFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →