Inventor · disambiguated record
Sarah H. Knickerbocker
Also filed as: KNICKERBOCKER SARAH · KNICKERBOCKER SARAH H · KNICKERBOCKER SARAH HUFFSMITH
39 granted patents·5 pending applications·585 citations·filing 1988–2023
98Inventor score
Top patents by PatentIndex Score
44 records- 0197US9401336B2Dual layer stack for contact formationIBM·Filed 2014·Granted Jul 26, 2016·48 cites·17 claims
- 0287US10090255B2Dicing channels for glass interposersGLOBALFOUNDRIES INC·Filed 2016·Granted Oct 2, 2018·6 cites·20 claims
- 0387US6335210B1Baseplate for chip burn-in and/of testing, and method thereofIBM·Filed 1999·Granted Jan 1, 2002·64 cites·13 claims
- 0486US5283104AVia paste compositions and use thereof to form conductive vias in circuitized ceramic substratesIBM·Filed 1991·Granted Feb 1, 1994·80 cites·31 claims
- 0583US9362223B2Integrated circuit assembly with cushion polymer layerIBM·Filed 2015·Granted Jun 7, 2016·4 cites·7 claims
- 0682US7144490B2Method for selective electroplating of semiconductor device I/O pads using a titanium-tungsten seed layerIBM·Filed 2003·Granted Dec 5, 2006·14 cites·7 claims
- 0782US6661100B1Low impedance power distribution structure for a semiconductor chip packageIBM·Filed 2002·Granted Dec 9, 2003·32 cites·20 claims
- 0882US5541005ALarge ceramic article and method of manufacturingIBM·Filed 1995·Granted Jul 30, 1996·64 cites·19 claims
- 0979US7833897B2Process for making interconnect solder Pb-free bumps free from organo-tin/tin deposits on the wafer surfaceIBM·Filed 2007·Granted Nov 16, 2010·7 cites·6 claims
- 1075US8753460B2Reduction of edge chipping during wafer handlingKNICKERBOCKER SARAH H·Filed 2011·Granted Jun 17, 2014·4 cites·5 claims
- 1172US7473997B2Method for forming robust solder interconnect structures by reducing effects of seed layer underetchingIBM·Filed 2005·Granted Jan 6, 2009·4 cites·10 claims
- 1269US7737003B2Method and structure for optimizing yield of 3-D chip manufactureIBM·Filed 2005·Granted Jun 15, 2010·4 cites·18 claims
- 1369US5831810AElectronic component package with decoupling capacitors completely within die receiving cavity of substrateIBM·Filed 1996·Granted Nov 3, 1998·41 cites·17 claims
- 1469US5337475AProcess for producing ceramic circuit structures having conductive viasIBM·Filed 1992·Granted Aug 16, 1994·37 cites·16 claims
- 1567US8807184B2Reduction of edge chipping during wafer handlingIBM·Filed 2013·Granted Aug 19, 2014·1 cites·5 claims
- 1662US12334461B2Bonding structure using two oxide layers with different stress levels, and related methodGLOBALFOUNDRIES US INC·Filed 2022·Granted Jun 17, 2025·0 cites·20 claims
- 1762US6995475B2I/C chip suitable for wire bondingIBM·Filed 2003·Granted Feb 7, 2006·9 cites·3 claims
- 1861US7999377B2Method and structure for optimizing yield of 3-D chip manufactureIBM·Filed 2008·Granted Aug 16, 2011·2 cites·7 claims
- 1961US6995084B2Method for forming robust solder interconnect structures by reducing effects of seed layer underetchingIBM·Filed 2004·Granted Feb 7, 2006·7 cites·12 claims
- 2060US12474519B2Photonics chip patterning with multiple photoresist layersGLOBALFOUNDRIES US INC·Filed 2023·Granted Nov 18, 2025·0 cites·20 claims
- 2158US5135595AProcess for fabricating a low dielectric composite substrateIBM·Filed 1990·Granted Aug 4, 1992·24 cites·9 claims
- 2257US5185215AZirconia toughening of glass-ceramic materialsIBM·Filed 1991·Granted Feb 9, 1993·26 cites·14 claims
- 2357US2011079702A1Forming a protective layer on a mold and mold having a protective layerIBM·Filed 2009·Application pending·0 cites
- 2456US11502106B2Multi-layered substrates of semiconductor devicesGLOBALFOUNDRIES US INC·Filed 2020·Granted Nov 15, 2022·0 cites·20 claims
- 2553US9209128B2Integrated circuit assembly with cushion polymer layerIBM·Filed 2014·Granted Dec 8, 2015·0 cites·10 claims
- 2653US5139851ALow dielectric composite substrateIBM·Filed 1990·Granted Aug 18, 1992·22 cites·19 claims
- 2751US5277725AProcess for fabricating a low dielectric composite substrateIBM·Filed 1992·Granted Jan 11, 1994·17 cites·15 claims
- 2851US4971738AEnhanced removal of carbon from ceramic substrate laminatesIBM·Filed 1988·Granted Nov 20, 1990·16 cites·10 claims
- 2950US8668834B2Protecting a mold having a substantially planar surface provided with a plurality of mold cavitiesJONES BRADLEY P·Filed 2012·Granted Mar 11, 2014·0 cites·9 claims
- 3047US10520679B2Fiber alignment to photonics chipGLOBALFOUNDRIES INC·Filed 2018·Granted Dec 31, 2019·0 cites·20 claims
- 3147US9171749B2Handler wafer removal facilitated by the addition of an amorphous carbon layer on the handler waferIBM·Filed 2013·Granted Oct 27, 2015·0 cites·18 claims
- 3247US7666780B2Alignment verification for C4NP solder transferIBM·Filed 2007·Granted Feb 23, 2010·0 cites·9 claims
- 3346US7572726B2Method of forming a bond pad on an I/C chip and resulting structureIBM·Filed 2005·Granted Aug 11, 2009·0 cites·15 claims
- 3446US2006249854A1Device with area array pads for test probingCHENG TIEN-JEN·Filed 2006·Application pending·0 cites
- 3546US2021173145A1Structures and methods for aligning and securing optical fibers in photonic integrated circuit (pic) packages using various adhesivesGLOBALFOUNDRIES US INC·Filed 2019·Application pending·0 cites
- 3645US7767575B2Forming robust solder interconnect structures by reducing effects of seed layer underetchingTESSERA INTELLECTUAL PROPERTIE·Filed 2009·Granted Aug 3, 2010·0 cites·5 claims
- 3745US5946552AUniversal cost reduced substrate structure method and apparatusIBM·Filed 1996·Granted Aug 31, 1999·15 cites·20 claims
- 3843US5139975ASintering arrangement for enhancing removal of carbon from ceramic substrate laminatesIBM·Filed 1991·Granted Aug 18, 1992·12 cites·15 claims
- 3941US5053361ASetter tile for use in sintering of ceramic substrate laminatesIBM·Filed 1990·Granted Oct 1, 1991·10 cites·4 claims
- 4040US2005167837A1Device with area array pads for test probingIBM·Filed 2004·Application pending·0 cites
- 4139US2014192341A1Fixture planarity evaluation methodIBM·Filed 2013·Application pending·0 cites
- 4234US6284574B1Method of producing heat dissipating structure for semiconductor devicesIBM·Filed 1999·Granted Sep 4, 2001·4 cites·5 claims
- 4334US5167913AMethod of forming an adherent layer of metallurgy on a ceramic substrateIBM·Filed 1991·Granted Dec 1, 1992·6 cites·25 claims
- 4432US5173331AZirconia toughening of glass-ceramic materialsIBM·Filed 1991·Granted Dec 22, 1992·5 cites·25 claims
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