Inventor · disambiguated record
Ching-Li Yang
Also filed as: YANG CHING LI
18 granted patents·5 pending applications·112 citations·filing 2006–2025
92Inventor score
Top patents by PatentIndex Score
23 records- 0195US7387950B1Method for forming a metal structureUNITED MICROELECTRONICS CORP·Filed 2006·Granted Jun 17, 2008·31 cites·10 claims
- 0294US8916471B1Method for forming semiconductor structure having through silicon via for signal and shielding structureUNITED MICROELECTRONICS CORP·Filed 2013·Granted Dec 23, 2014·35 cites·19 claims
- 0387US8518823B2Through silicon via and method of forming the sameHUANG KUO-HSIUNG·Filed 2011·Granted Aug 27, 2013·14 cites·5 claims
- 0485US9012324B2Through silicon via processChen jia-jia·Filed 2012·Granted Apr 21, 2015·11 cites·15 claims
- 0584US9773860B1Capacitor and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2016·Granted Sep 26, 2017·4 cites·16 claims
- 0681US8841755B2Through silicon via and method of forming the sameUNITED MICROELECTRONICS CORP·Filed 2013·Granted Sep 23, 2014·5 cites·10 claims
- 0777US7649268B2Semiconductor waferUNITED MICROELECTRONICS CORP·Filed 2007·Granted Jan 19, 2010·4 cites·10 claims
- 0873US2025285993A1Manufacturing method of semiconductor structure including seal ring structureUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 0970US10892235B2Die seal ring and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jan 12, 2021·1 cites·9 claims
- 1069US12315827B2Semiconductor structure including seal ring structureUNITED MICROELECTRONICS CORP·Filed 2022·Granted May 27, 2025·0 cites·10 claims
- 1169US10978391B2Connection structure of semiconductor device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2017·Granted Apr 13, 2021·1 cites·8 claims
- 1268US8900996B2Through silicon via structure and method of fabricating the sameCHEN HSIN-YU·Filed 2012·Granted Dec 2, 2014·2 cites·10 claims
- 1368US8884398B2Anti-fuse structure and programming method thereofUNITED MICROELECTRONICS CORP·Filed 2013·Granted Nov 11, 2014·2 cites·20 claims
- 1464US9312208B2Through silicon via structureUNITED MICROELECTRONICS CORP·Filed 2014·Granted Apr 12, 2016·1 cites·4 claims
- 1564US9048246B2Die seal ring and method of forming the sameUNITED MICROELECTRONICS CORP·Filed 2013·Granted Jun 2, 2015·1 cites·19 claims
- 1662US11664333B2Method of manufacturing die seal ringUNITED MICROELECTRONICS CORP·Filed 2020·Granted May 30, 2023·0 cites·8 claims
- 1761US11916018B2Manufacturing method of connection structure of semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2021·Granted Feb 27, 2024·0 cites·6 claims
- 1855US7696606B2Metal structureUNITED MICROELECTRONICS CORP·Filed 2007·Granted Apr 13, 2010·0 cites·14 claims
- 1944US8691688B2Method of manufacturing semiconductor structureCHEN HSIN-YU·Filed 2012·Granted Apr 8, 2014·0 cites·17 claims
- 2039US2013270712A1Through silicon via structure and method of fabricating the sameCHEN HSIN-YU·Filed 2012·Application pending·0 cites
- 2138US2013037953A1Through silicon via structure and manufacturing method thereofCHEN HSIN-YU·Filed 2011·Application pending·0 cites
- 2238US2013256843A1Wafer sawing method and wafer structure beneficial for performing the sameCHEN HSIN-YU·Filed 2012·Application pending·0 cites
- 2336US2018061752A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →