Inventor · disambiguated record
Ikuya Miyazawa
Also filed as: MIYAZAWA IKUYA
12 granted patents·2 pending applications·503 citations·filing 2002–2019
90Inventor score
Top patents by PatentIndex Score
14 records- 0195US6873054B2Semiconductor device and a method of manufacturing the same, a circuit board and an electronic apparatusSEIKO EPSON CORP·Filed 2003·Granted Mar 29, 2005·234 cites·13 claims
- 0292US7214615B2Method of manufacturing semiconductor device, semiconductor device, circuit substrate and electronic apparatusSEIKO EPSON CORP·Filed 2004·Granted May 8, 2007·113 cites·9 claims
- 0389US6841849B2Semiconductor device and method of manufacturing the same, circuit board and electronic instrumentSEIKO EPSON CORP·Filed 2003·Granted Jan 11, 2005·66 cites·32 claims
- 0488US7029937B2Semiconductor device and method of manufacturing the same, circuit board, and electronic instrumentSEIKO EPSON CORP·Filed 2003·Granted Apr 18, 2006·84 cites·22 claims
- 0562US10850519B2Liquid ejecting head and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2019·Granted Dec 1, 2020·0 cites·5 claims
- 0653US8960865B2Liquid droplet ejecting head and printing apparatusSEIKO EPSON CORP·Filed 2013·Granted Feb 24, 2015·0 cites·16 claims
- 0751US10603914B2MEMS device, liquid ejecting head, and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2018·Granted Mar 31, 2020·0 cites·11 claims
- 0849US8960861B2Liquid droplet ejecting head, printing apparatus and method of manufacturing liquid droplet ejecting headSEIKO EPSON CORP·Filed 2013·Granted Feb 24, 2015·0 cites·20 claims
- 0949US6732907B2Soldering method, soldering device, and method and device of fabricating electronic circuit moduleSEIKO EPSON CORP·Filed 2002·Granted May 11, 2004·3 cites·21 claims
- 1049US6730173B2Method and apparatus of manufacturing electronic circuit module, and method and apparatus of manufacturing semiconductor moduleSEIKO EPSON CORP·Filed 2002·Granted May 4, 2004·3 cites·12 claims
- 1140US9822452B2Conduction structure, method of manufacturing conduction structure, droplet ejecting head, and printing apparatusSEIKO EPSON CORP·Filed 2015·Granted Nov 21, 2017·0 cites·20 claims
- 1238US2005230805A1Semiconductor device, method for producing the same, circuit board, and electronic apparatusMIYAZAWA IKUYA·Filed 2005·Application pending·0 cites
- 1337US2004245623A1Semiconductor device, circuit substrate and electronic instrumentFiled 2004·Application pending·0 cites
- 1433US9708715B2Conduction structure, method of manufacturing conduction structure, droplet ejecting head, and printing apparatusSEIKO EPSON CORP·Filed 2015·Granted Jul 18, 2017·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →