Inventor · disambiguated record
Siamak Fazelpour
Also filed as: FAZELPOUR SIAMAK
21 granted patents·5 pending applications·394 citations·filing 1999–2014
96Inventor score
Files withSKYWORKS SOLUTIONS INC8QUALCOMM INC7APPLIED MICRO CIRCUITS CORP5CONEXANT SYSTEMS INC3FAZELPOUR SIAMAK1
Top patents by PatentIndex Score
26 records- 0194US8269348B2IC die including RDL capture pads with notch having bonding connectors or its UBM pad over the notchFAZELPOUR SIAMAK·Filed 2010·Granted Sep 18, 2012·38 cites·17 claims
- 0293US6617943B1Package substrate interconnect layout for providing bandpass/lowpass filteringAPPLIED MICRO CIRCUITS CORP·Filed 2001·Granted Sep 9, 2003·38 cites·28 claims
- 0389US9536805B2Power management integrated circuit (PMIC) integration into a processor packageQUALCOMM INC·Filed 2014·Granted Jan 3, 2017·12 cites·25 claims
- 0483US6608363B1Transformer comprising stacked inductorsSKYWORKS SOLUTIONS INC·Filed 2001·Granted Aug 19, 2003·33 cites·20 claims
- 0583US6534854B1Pin grid array package with controlled impedance pinsCONEXANT SYSTEMS INC·Filed 2001·Granted Mar 18, 2003·36 cites·31 claims
- 0683US6512285B1High inductance inductor in a semiconductor packageSKYWORKS SOLUTIONS INC·Filed 2001·Granted Jan 28, 2003·35 cites·22 claims
- 0782US6674174B2Controlled impedance transmission lines in a redistribution layerSKYWORKS SOLUTIONS INC·Filed 2001·Granted Jan 6, 2004·37 cites·25 claims
- 0877US10008316B2Inductor embedded in a package substrateQUALCOMM INC·Filed 2014·Granted Jun 26, 2018·4 cites·27 claims
- 0973US6611048B1Exposed paddle leadframe for semiconductor die packagingSKYWORKS SOLUTIONS INC·Filed 2000·Granted Aug 26, 2003·22 cites·16 claims
- 1073US6566761B1Electronic device package with high speed signal interconnect between die pad and external substrate padAPPLIED MICRO CIRCUITS CORP·Filed 2002·Granted May 20, 2003·22 cites·21 claims
- 1170US6781229B1Method for integrating passives on-die utilizing under bump metal and related structureSKYWORKS SOLUTIONS INC·Filed 2001·Granted Aug 24, 2004·17 cites·30 claims
- 1269US6576983B1Controlled impedance leads in a leadframe for high frequency applicationsSKYWORKS SOLUTIONS INC·Filed 2001·Granted Jun 10, 2003·16 cites·29 claims
- 1367US9214426B1Highly coupled spiral planar inductors structure at bump to compensate on die excess capacitance of differential I/OQUALCOMM INC·Filed 2014·Granted Dec 15, 2015·2 cites·20 claims
- 1467US6812576B1Fanned out interconnect via structure for electronic package substratesAPPLIED MICRO CIRCUITS CORP·Filed 2002·Granted Nov 2, 2004·15 cites·2 claims
- 1567US6674646B1Voltage regulation for semiconductor dies and related structureSKYWORKS SOLUTIONS INC·Filed 2001·Granted Jan 6, 2004·15 cites·23 claims
- 1662US6713853B1Electronic package with offset reference plane cutoutAPPLIED MICRO CIRCUITS CORP·Filed 2002·Granted Mar 30, 2004·11 cites·18 claims
- 1761US9514966B2Apparatus and methods for shielding differential signal pin pairsQUALCOMM INC·Filed 2014·Granted Dec 6, 2016·1 cites·15 claims
- 1859US6501158B1Structure and method for securing a molding compound to a leadframe paddleSKYWORKS SOLUTIONS INC·Filed 2000·Granted Dec 31, 2002·10 cites·18 claims
- 1954US6762494B1Electronic package substrate with an upper dielectric layer covering high speed signal tracesAPPLIED MICRO CIRCUITS CORP·Filed 2002·Granted Jul 13, 2004·6 cites·24 claims
- 2046US6274925B1Low inductance top metal layer designCONEXANT SYSTEMS INC·Filed 1999·Granted Aug 14, 2001·13 cites·9 claims
- 2144US2016095225A1Inductor system for multi-phase power management integrated circuitsQUALCOMM INC·Filed 2014·Application pending·0 cites
- 2243US6424541B1Electronic device attachment methods and apparatus for forming an assemblyCONEXANT SYSTEMS INC·Filed 1999·Granted Jul 23, 2002·11 cites·14 claims
- 2340US2015372425A1Custom orientation of socket pins to achieve high isolation between channels without adding extra reference pinsQUALCOMM INC·Filed 2014·Application pending·0 cites
- 2436US2016006149A1Looped socket pinQUALCOMM INC·Filed 2014·Application pending·0 cites
- 2535US2002113309A1Shielding of RF devicesFiled 2001·Application pending·0 cites
- 2633US2004038451A1Method suitable for forming a microelectronic device packageFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →