Inventor · disambiguated record
Kiyoaki Kadoi
Also filed as: KADOI KIYOAKI
8 granted patents·5 pending applications·305 citations·filing 1997–2025
86Inventor score
Top patents by PatentIndex Score
13 records- 0195US6022792ASemiconductor dicing and assembling methodSEIKO INSTR INC·Filed 1997·Granted Feb 8, 2000·215 cites·13 claims
- 0286US6563216B1Semiconductor device having a bump electrodeSEIKO INSTR INC·Filed 2000·Granted May 13, 2003·48 cites·16 claims
- 0372US12140612B2Current detection deviceABLIC INC·Filed 2023·Granted Nov 12, 2024·0 cites·9 claims
- 0471US6492692B1Semiconductor integrated circuit and manufacturing method thereforeSEIKO INSTR INC·Filed 1999·Granted Dec 10, 2002·36 cites·8 claims
- 0569US7557016B2Dicing method using an encased dicing blade submerged in cooling waterSEIKO INSTR INC·Filed 2007·Granted Jul 7, 2009·3 cites·18 claims
- 0664US7750443B2Semiconductor device packageSEIKO INSTR INC·Filed 2008·Granted Jul 6, 2010·3 cites·5 claims
- 0750US2022254706A1Semiconductor deviceABLIC INC·Filed 2022·Application pending·0 cites
- 0849US10262924B2Semiconductor device and electronic apparatusABLIC INC·Filed 2018·Granted Apr 16, 2019·0 cites·15 claims
- 0947US2025273543A1Semiconductor deviceABLIC INC·Filed 2025·Application pending·0 cites
- 1046US2025273542A1Semiconductor deviceABLIC INC·Filed 2025·Application pending·0 cites
- 1141US11251110B2Semiconductor device and method of manufacturing the semiconductor deviceABLIC INC·Filed 2019·Granted Feb 15, 2022·0 cites·12 claims
- 1241US2020020617A1Resin encapsulating mold and manufacturing method for semiconductor deviceABLIC INC·Filed 2019·Application pending·0 cites
- 1335US2017213775A1Semiconductor deviceSII SEMICONDUCTOR CORP·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →