Inventor · disambiguated record
Jiun-Heng Wang
Also filed as: WANG JIUN-HENG
8 granted patents·1 pending application·22 citations·filing 2005–2023
80Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD4CHIPMOS TECHNOLOGIES INC3CHIPMOS TECHNOLOGIES BERMUDA1WANG JIUN-HENG1
Top patents by PatentIndex Score
9 records- 0196US10468379B13DIC structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 5, 2019·13 cites·20 claims
- 0280US12074136B2Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 27, 2024·0 cites·20 claims
- 0373US11587907B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 21, 2023·0 cites·20 claims
- 0473US7651886B2Semiconductor device and manufacturing process thereofCHIPMOS TECHNOLOGIES INC·Filed 2006·Granted Jan 26, 2010·7 cites·9 claims
- 0563US10950576B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 16, 2021·0 cites·20 claims
- 0657US7538020B2Chip packaging processCHIPMOS TECHNOLOGIES INC·Filed 2006·Granted May 26, 2009·2 cites·5 claims
- 0741US2007096272A1Light emitting diode packageWANG JIUN-HENG·Filed 2006·Application pending·0 cites
- 0840US7370416B2Method of manufacturing an injector plateCHIPMOS TECHNOLOGIES BERMUDA·Filed 2005·Granted May 13, 2008·0 cites·9 claims
- 0936US7405144B2Method for manufacturing probe cardCHIPMOS TECHNOLOGIES INC·Filed 2006·Granted Jul 29, 2008·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →