Inventor · disambiguated record
Franz Zach
Also filed as: ZACH FRANZ · ZACH FRANZ X · ZACH FRANZ XAVER
29 granted patents·6 pending applications·519 citations·filing 1998–2025
97Inventor score
Top patents by PatentIndex Score
35 records- 0199US7882456B2Optical lithography correction processCADENCE DESIGN SYSTEMS INC·Filed 2005·Granted Feb 1, 2011·150 cites·19 claims
- 0298US11782411B2System and method for mitigating overlay distortion patterns caused by a wafer bonding toolKLA CORP·Filed 2022·Granted Oct 10, 2023·5 cites·15 claims
- 0396US6961920B2Method for interlayer and yield based optical proximity correctionIBM·Filed 2003·Granted Nov 1, 2005·61 cites·7 claims
- 0495US7784019B1Yield based retargeting for semiconductor design flowCADENCE DESIGN SYSTEMS INC·Filed 2007·Granted Aug 24, 2010·51 cites·20 claims
- 0595US7600212B2Method of compensating photomask data for the effects of etch and lithography processesCADENCE DESIGN SYSTEMS INC·Filed 2006·Granted Oct 6, 2009·39 cites·55 claims
- 0694US12164277B2System and method for mitigating overlay distortion patterns caused by a wafer bonding toolKLA CORP·Filed 2023·Granted Dec 10, 2024·1 cites·18 claims
- 0794US7444615B2Calibration on wafer sweet spotsINVARIUM INC·Filed 2005·Granted Oct 28, 2008·25 cites·25 claims
- 0893US11829077B2System and method for determining post bonding overlayKLA CORP·Filed 2021·Granted Nov 28, 2023·3 cites·19 claims
- 0991US12197137B2System and method for determining post bonding overlayKLA CORP·Filed 2023·Granted Jan 14, 2025·1 cites·21 claims
- 1090US7392502B2Method for real time monitoring and verifying optical proximity correction model and methodINVARIUM INC·Filed 2005·Granted Jun 24, 2008·16 cites·20 claims
- 1190US7334212B2Method for interlayer and yield based optical proximity correctionIBM·Filed 2005·Granted Feb 19, 2008·8 cites·7 claims
- 1288US6936522B2Selective silicon-on-insulator isolation structure and methodIBM·Filed 2003·Granted Aug 30, 2005·37 cites·22 claims
- 1387US8141008B2Optical lithography correction processZACH FRANZ XAVER·Filed 2010·Granted Mar 20, 2012·7 cites·20 claims
- 1486US7536670B2Method for verifying and choosing lithography modelCADENCE DESIGN SYSTEMS INC·Filed 2005·Granted May 19, 2009·11 cites·21 claims
- 1582US7326983B2Selective silicon-on-insulator isolation structure and methodIBM·Filed 2005·Granted Feb 5, 2008·8 cites·14 claims
- 1681US7588868B2Method and system for reducing the impact of across-wafer variations on critical dimension measurementsCADENCE DESIGN SYSTEMS INC·Filed 2004·Granted Sep 15, 2009·18 cites·42 claims
- 1781US2025103019A1System and method for mitigating overlay distortion patterns caused by a wafer bonding toolKLA CORP·Filed 2024·Application pending·0 cites
- 1878US7224437B2Method for measuring and verifying stepper illuminationINVARIUM INC·Filed 2005·Granted May 29, 2007·5 cites·28 claims
- 1973US7712069B2Method for interlayer and yield based optical proximity correctionIBM·Filed 2007·Granted May 4, 2010·2 cites·7 claims
- 2071US7246343B2Method for correcting position-dependent distortions in patterning of integrated circuitsINVARIUM INC·Filed 2004·Granted Jul 17, 2007·10 cites·37 claims
- 2169US7923786B2Selective silicon-on-insulator isolation structure and methodIBM·Filed 2007·Granted Apr 12, 2011·3 cites·17 claims
- 2269US2025251669A1System and method for determining post bonding overlayKLA CORP·Filed 2025·Application pending·0 cites
- 2365US2023030116A1System and method for optimizing through silicon via overlayKLA CORP·Filed 2022·Application pending·0 cites
- 2464US6927172B2Process to suppress lithography at a wafer edgeINFINEON TECHNOLOGIES AG·Filed 2003·Granted Aug 9, 2005·10 cites·18 claims
- 2564US6204187B1Contact and deep trench patterningINFINEON TECHNOLOGIES CORP·Filed 1999·Granted Mar 20, 2001·31 cites·21 claims
- 2658US7861209B2Method for interlayer and yield based optical proximity correctionIBM·Filed 2007·Granted Dec 28, 2010·0 cites·6 claims
- 2758US2023032406A1System and method for detecting particle contamination on a bonding toolKLA CORP·Filed 2022·Application pending·0 cites
- 2853US6485894B1Method to self-align a lithographic pattern to a workpieceIBM·Filed 2000·Granted Nov 26, 2002·3 cites·21 claims
- 2953US6132940AMethod for producing constant profile sidewallsIBM·Filed 1998·Granted Oct 17, 2000·14 cites·14 claims
- 3046US2009033353A1Systems and methods for electrical characterization of inter-layer alignmentPDF SOLUTIONS·Filed 2008·Application pending·0 cites
- 3143US10386829B2Systems and methods for controlling an etch processKLA TENCOR CORP·Filed 2016·Granted Aug 20, 2019·0 cites·36 claims
- 3241US7189481B2Characterizing flare of a projection lensINVARIUM INC·Filed 2004·Granted Mar 13, 2007·0 cites·44 claims
- 3340US7124396B2Alternating phase-shift mask rule compliant IC designIBM·Filed 2004·Granted Oct 17, 2006·0 cites·20 claims
- 3439US2006072097A1Method for characterization of the illuminator in a lithographic systemZACH FRANZ X·Filed 2004·Application pending·0 cites
- 3529US6270947B2Method and apparatus for reducing non-uniformity area effects in the manufacture of semiconductor devicesINFINEON TECHNOLOGIES AG·Filed 1999·Granted Aug 7, 2001·0 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →