Inventor · disambiguated record
Teruyuki Hotta
Also filed as: HOTTA TERUYUKI
34 granted patents·7 pending applications·551 citations·filing 1982–2019
97Inventor score
Top patents by PatentIndex Score
41 records- 0195US5248527AProcess for electroless plating tin, lead or tin-lead alloyUYEMURA AND COMPANY LIMITED C·Filed 1992·Granted Sep 28, 1993·288 cites·13 claims
- 0293US10981475B2Seat air-conditioning systemDENSO CORP·Filed 2019·Granted Apr 20, 2021·6 cites·13 claims
- 0387US8197583B2Electroless plating solution, method for electroless plating using the same and method for manufacturing circuit boardHOTTA TERUYUKI·Filed 2011·Granted Jun 12, 2012·4 cites·4 claims
- 0484US9683761B2Integration valve and heat pump cycleDENSO CORP·Filed 2012·Granted Jun 20, 2017·5 cites·18 claims
- 0581US9359676B2Surface treating apparatusUYEMURA C & CO LTD·Filed 2013·Granted Jun 7, 2016·3 cites·12 claims
- 0681US9120113B2Surface treating apparatusUYEMURA C & CO LTD·Filed 2013·Granted Sep 1, 2015·2 cites·7 claims
- 0776US9636622B2AccumulatorDENSO CORP·Filed 2013·Granted May 2, 2017·3 cites·9 claims
- 0876US6427480B1Refrigerant cycle systemDENSO CORP·Filed 2001·Granted Aug 6, 2002·24 cites·50 claims
- 0974US10500925B2Refrigeration cycle deviceDENSO CORP·Filed 2018·Granted Dec 10, 2019·2 cites·14 claims
- 1074US9726407B2Expansion valve for a refrigeration cycleDENSO CORP·Filed 2012·Granted Aug 8, 2017·3 cites·3 claims
- 1167US9541316B2AccumulatorTAKEDA YUKIHIKO·Filed 2012·Granted Jan 10, 2017·2 cites·7 claims
- 1267US6981390B2Refrigerant cycle systemDENSO CORP·Filed 2003·Granted Jan 3, 2006·15 cites·19 claims
- 1365US8137447B2Electroless plating solution, method for electroless plating using the same and method for manufacturing circuit boardHOTTA TERUYUKI·Filed 2009·Granted Mar 20, 2012·0 cites·8 claims
- 1464US5266103ABath and method for the electroless plating of tin and tin-lead alloyUEMURA KOGYO KK·Filed 1992·Granted Nov 30, 1993·25 cites·12 claims
- 1563US8276270B2Method for manufacturing printed circuit boardHOTTA TERUYUKI·Filed 2008·Granted Oct 2, 2012·4 cites·2 claims
- 1663US6935126B2Refrigeration cycle systemDENSO CORP·Filed 2003·Granted Aug 30, 2005·12 cites·19 claims
- 1763US4441863AVariable discharge rotary compressorNIPPON DENSO CO·Filed 1982·Granted Apr 10, 1984·19 cites·3 claims
- 1862US6935128B2Vapor-compression-type refrigerating machineDENSO CORP·Filed 2004·Granted Aug 30, 2005·10 cites·12 claims
- 1961USRE42908EVapor-compression-type refrigerating machineITO SHIGEKI·Filed 2005·Granted Nov 15, 2011·2 cites·29 claims
- 2061US6053417AExpansion valve integrated with electromagnetic valveDENSO CORP·Filed 1998·Granted Apr 25, 2000·24 cites·5 claims
- 2161US5943871AThermal expansion valveDENSO CORP·Filed 1997·Granted Aug 31, 1999·25 cites·23 claims
- 2259US6698236B2Refrigerant cycle system and condenserDENSO CORP·Filed 2003·Granted Mar 2, 2004·10 cites·5 claims
- 2358US6533245B2Valve deviceKOBE STEEL LTD·Filed 2001·Granted Mar 18, 2003·9 cites·12 claims
- 2458US6012300APressure control valve for refrigerating systemDENSO CORP·Filed 1998·Granted Jan 11, 2000·22 cites·11 claims
- 2554US6397616B2Pressure reducer and refrigerating cycle unit using the sameDENSO CORP·Filed 2001·Granted Jun 4, 2002·7 cites·14 claims
- 2652US11001936B2Surface treating deviceUEMURA KOGYO KK·Filed 2019·Granted May 11, 2021·0 cites·6 claims
- 2752US6634567B2Expansion valve unit having pressure detecting functionDENSON CORP·Filed 2002·Granted Oct 21, 2003·6 cites·8 claims
- 2851US2016290525A1Electric expansion valveDENSO CORP·Filed 2014·Application pending·0 cites
- 2950US2009092749A1Manufacture method of buildup circuit boardUYEMURA C & CO LTD·Filed 2008·Application pending·0 cites
- 3050US2013295294A1Electroless copper plating bath and electroless copper plating methodUYEMURA C & CO LTD·Filed 2012·Application pending·0 cites
- 3149US11480197B2Ejector moduleDENSO CORP·Filed 2019·Granted Oct 25, 2022·0 cites·20 claims
- 3249US8262831B2Method for forming a circuit patternHASHIMOTO SHIGEO·Filed 2008·Granted Sep 11, 2012·0 cites·3 claims
- 3349US2015289382A1Production method for printed wiring board and printed wiring board produced by said methodUYEMURA C & CO LTD·Filed 2013·Application pending·0 cites
- 3448US9109823B2Integration valveDENSO CORP·Filed 2012·Granted Aug 18, 2015·0 cites·14 claims
- 3548US2020086774A1Seat air-conditioning deviceDENSO CORP·Filed 2019·Application pending·0 cites
- 3647US11460049B2EjectorDENSO CORP·Filed 2018·Granted Oct 4, 2022·0 cites·6 claims
- 3747US2013056362A1Manufacture method of buildup circuit boardUYEMURA AND CO LTD C·Filed 2012·Application pending·0 cites
- 3844US5294554AAnalysis of tin, lead or tin-lead alloy plating solutionUEMURA KOGYO KK·Filed 1992·Granted Mar 15, 1994·10 cites·25 claims
- 3943US5234572AMetal ion replenishment to plating bathUEMURA KOGYO KK·Filed 1992·Granted Aug 10, 1993·9 cites·2 claims
- 4038US8769984B2Decompression deviceITOU TETSUYA·Filed 2010·Granted Jul 8, 2014·0 cites·9 claims
- 4136US2011259373A1Method and agent for surface processing of printed circuit board substrateUYEMURA CO LTD C·Filed 2011·Application pending·0 cites
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