Inventor · disambiguated record
Thomas A. Degenkolb
Also filed as: DEGENKOLB THOMAS A · DEGENKOLB THOMAS ALAN
23 granted patents·4 pending applications·368 citations·filing 2000–2023
96Inventor score
Files withDELPHI TECH INC21BRANDENBURG SCOTT D2BORGWARNER US TECH LLC1DELPHI TECH IP LTD1MYERS BRUCE A1
Top patents by PatentIndex Score
27 records- 0195US7485957B2Fluid cooled encapsulated microelectronic packageDELPHI TECH INC·Filed 2007·Granted Feb 3, 2009·28 cites·1 claims
- 0293US7616448B2Wrap-around overmold for electronic assemblyDELPHI TECH INC·Filed 2007·Granted Nov 10, 2009·43 cites·7 claims
- 0392US6779260B1Overmolded electronic package including circuit-carrying substrateDELPHI TECH INC·Filed 2003·Granted Aug 24, 2004·71 cites·32 claims
- 0488US7537464B2Electrical pin interconnection for electronic packageDELPHI TECH INC·Filed 2006·Granted May 26, 2009·28 cites·21 claims
- 0587US8026597B2Fluid cooled encapsulated microelectronic packageDELPHI TECH INC·Filed 2008·Granted Sep 27, 2011·10 cites·2 claims
- 0686US8471380B2Fluid cooled encapsulated microelectronic packageBRANDENBURG SCOTT D·Filed 2011·Granted Jun 25, 2013·6 cites·4 claims
- 0786US7759778B2Leaded semiconductor power module with direct bonding and double sided coolingDELPHI TECH INC·Filed 2008·Granted Jul 20, 2010·16 cites·5 claims
- 0886US7205653B2Fluid cooled encapsulated microelectronic packageDELPHI TECH INC·Filed 2004·Granted Apr 17, 2007·29 cites·8 claims
- 0983US6535396B1Combination circuit board and segmented conductive bus substrateDELPHI TECH INC·Filed 2000·Granted Mar 18, 2003·36 cites·13 claims
- 1078US7324342B2Electronics assembly and electronics package carrier thereforDELPHI TECH INC·Filed 2005·Granted Jan 29, 2008·12 cites·18 claims
- 1175US6560110B1Corrosive resistant flip chip thermal management structureDELPHI TECH INC·Filed 2002·Granted May 6, 2003·19 cites·26 claims
- 1273US9506803B2Vehicle optical sensor systemDELPHI TECH INC·Filed 2014·Granted Nov 29, 2016·2 cites·7 claims
- 1372US7364684B2Method of making an encapsulated microelectronic package having fluid carrying encapsulant channelsDELPHI TECH INC·Filed 2004·Granted Apr 29, 2008·9 cites·5 claims
- 1471US7106588B2Power electronic system with passive coolingDELPHI TECH INC·Filed 2003·Granted Sep 12, 2006·18 cites·21 claims
- 1570US7064963B2Multi-substrate circuit assemblyDELPHI TECH INC·Filed 2004·Granted Jun 20, 2006·16 cites·20 claims
- 1665US7447041B2Compression connection for vertical IC packagesDELPHI TECH INC·Filed 2007·Granted Nov 4, 2008·3 cites·7 claims
- 1765US6905349B1Technique for connector to printed circuit board decoupling to eliminate flexureDELPHI TECH INC·Filed 2004·Granted Jun 14, 2005·11 cites·14 claims
- 1864US7268429B2Technique for manufacturing an overmolded electronic assemblyDELPHI TECH INC·Filed 2005·Granted Sep 11, 2007·3 cites·20 claims
- 1961US12484197B2Systems and methods for a top side cooled power semiconductor thermal interface spacerBORGWARNER US TECH LLC·Filed 2023·Granted Nov 25, 2025·0 cites·20 claims
- 2057US7227758B2Printed circuit board assembly with integrated connectorDELPHI TECH INC·Filed 2003·Granted Jun 5, 2007·6 cites·19 claims
- 2152US2024413551A1High current printed circuit board mount terminal for magnetic or leaded componentsDELPHI TECH IP LTD·Filed 2023·Application pending·0 cites
- 2250US9621874B2Multiple imager cameraDELPHI TECH INC·Filed 2014·Granted Apr 11, 2017·0 cites·4 claims
- 2349US7621757B2Solderless electrical interconnection for electronic packageDELPHI TECH INC·Filed 2006·Granted Nov 24, 2009·2 cites·20 claims
- 2440US2007004090A1Electronic assembly with backplate having at least one thermal insertBRANDENBURG SCOTT D·Filed 2005·Application pending·0 cites
- 2539US7422448B2Surface mount connectorDELPHI TECH INC·Filed 2005·Granted Sep 9, 2008·0 cites·21 claims
- 2638US2006021792A1Surface mount axial leaded component for an electronic moduleMYERS BRUCE A·Filed 2004·Application pending·0 cites
- 2736US2004132322A1Filtered electrical connector assembly for an overmolded electronic packageFiled 2003·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Thomas A. Degenkolb files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →