Inventor · disambiguated record
Dae Jo Hong
Also filed as: HONG DAE JO
4 granted patents·7 pending applications·0 citations·filing 2010–2015
53Inventor score
Top patents by PatentIndex Score
11 records- 0147US9235129B2Composition for photoresist development and method of developing photoresist using the sameSAMSUNG ELECTRO MECH·Filed 2014·Granted Jan 12, 2016·0 cites·16 claims
- 0243US2015053456A1Printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 0343US2013089703A1Solder resist composition, board for package comprising solder resist opening using the composition, and method for preparing the board for packageSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 0442US2015156860A1Solder resist opening structure and circuit boardSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 0537US2013175238A1Etching solution and method of manufacturing printed wiring substrate using the sameHONG DAE JO·Filed 2012·Application pending·0 cites
- 0636US8865393B2Printed circuit board and method of manufacturing the sameHONG DAE JO·Filed 2011·Granted Oct 21, 2014·0 cites·10 claims
- 0736US2015118603A1Photo mask and method of manufacturing the same, and method of forming trenches by using photo maskSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 0831US8084349B2Method for forming post bumpHONG DAE JO·Filed 2010·Granted Dec 27, 2011·0 cites·19 claims
- 0930US2012055901A1Substrate fabricating apparatus and substrate fabricating methodLEE CHANG BO·Filed 2011·Application pending·0 cites
- 1029US9107329B2Method for manufacturing printed circuit boardLEE CHANG BO·Filed 2011·Granted Aug 11, 2015·0 cites·15 claims
- 1127US2015198888A1Method for manufacturing substrate for packageSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →