Inventor · disambiguated record
Yoshimi Sudo
Also filed as: SUDO YOSHIMI
11 granted patents·1 pending application·213 citations·filing 1983–2014
91Inventor score
Files withJAPAN STYRENE PAPER CORP6HITACHI LTD2JAPANE STYRENE PAPER CORP1KATO TAKAHIKO1RENESAS ELECTRONICS CORP1
Top patents by PatentIndex Score
12 records- 0183US5877498AMethod and apparatus for X-ray analysesHITACHI LTD·Filed 1997·Granted Mar 2, 1999·42 cites·20 claims
- 0272US4695593APrefoamed propylene polymer-base particles, expansion-molded article produced from said particles and production process of said articleJAPANE STYRENE PAPER CORP·Filed 1986·Granted Sep 22, 1987·29 cites·4 claims
- 0372US4587270APreliminarily foamed particles of non-crosslinked polypropylene-type resinJAPAN STYRENE PAPER CORP·Filed 1984·Granted May 6, 1986·21 cites·5 claims
- 0471US4617323APrefoamed particles of crosslinked propylene-type resin and molded article prepared therefromJAPAN STYRENE PAPER CORP·Filed 1985·Granted Oct 14, 1986·27 cites·4 claims
- 0569US5594246AMethod and apparatus for x-ray analysesHITACHI LTD·Filed 1995·Granted Jan 14, 1997·21 cites·75 claims
- 0666US4567208APreliminarily foamed particles of non-crosslinked polypropylene-type resinJAPAN STYRENE PAPER CORP·Filed 1984·Granted Jan 28, 1986·18 cites·6 claims
- 0765US4504601AProcess for producing pre-foamed particles of polypropylene resinJAPAN STYRENE PAPER CORP·Filed 1983·Granted Mar 12, 1985·24 cites·9 claims
- 0855US4806293AMethod of producing a foamed, molded articleJAPAN STYRENE PAPER CORP·Filed 1987·Granted Feb 21, 1989·20 cites·5 claims
- 0955US4504653AProcess for producing polyolefin resin particlesJAPAN STYRENE PAPER CORP·Filed 1983·Granted Mar 12, 1985·11 cites·15 claims
- 1053US9362184B2Semiconductor device, manufacturing method of semiconductor device, semiconductor manufacturing and inspecting apparatus, and inspecting apparatusRENESAS ELECTRONICS CORP·Filed 2014·Granted Jun 7, 2016·0 cites·12 claims
- 1144US8946895B2Semiconductor device, manufacturing method of semiconductor device, semiconductor manufacturing and inspecting apparatus, and inspecting apparatusKATO TAKAHIKO·Filed 2009·Granted Feb 3, 2015·0 cites·2 claims
- 1243US2007134920A1Cu wiring formation methodRENESAS TECH CORP·Filed 2006·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Yoshimi Sudo files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →