Inventor · disambiguated record
Wen-Fang Liu
Also filed as: LIU WEN FANG
15 granted patents·4 pending applications·25 citations·filing 2010–2019
88Inventor score
Top patents by PatentIndex Score
19 records- 0192US10039184B2Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2017·Granted Jul 31, 2018·9 cites·6 claims
- 0286US10356901B2Manufacturing method of circuit board structureUNIMICRON TECHNOLOGY CORP·Filed 2018·Granted Jul 16, 2019·4 cites·8 claims
- 0384US10056356B1Chip package circuit board moduleUNIMICRON TECHNOLOGY CORP·Filed 2017·Granted Aug 21, 2018·5 cites·8 claims
- 0472US10497847B2Structure and manufacturing method of heat dissipation substrate and package structure and method thereofUNIMICRON TECHNOLOGY CORP·Filed 2017·Granted Dec 3, 2019·2 cites·20 claims
- 0570US8288662B2Circuit structureTSENG TZYY-JANG·Filed 2010·Granted Oct 16, 2012·2 cites·12 claims
- 0666US2014069574A1Manufacturing method of circuit boardUNIMICRON TECHNOLOGY CORP·Filed 2013·Application pending·0 cites
- 0765US10159151B1Chip package circuit board moduleUNIMICRON TECHNOLOGY CORP·Filed 2017·Granted Dec 18, 2018·1 cites·6 claims
- 0863US10813231B2Method for manufacturing circuit boardUNIMICRON TECHNOLOGY CORP·Filed 2019·Granted Oct 20, 2020·0 cites·5 claims
- 0963US8294042B2Connector and manufacturing method thereofLEE CHANG-MING·Filed 2010·Granted Oct 23, 2012·2 cites·6 claims
- 1061US8598463B2Circuit board and manufacturing method thereofTSENG TZYY-JANG·Filed 2011·Granted Dec 3, 2013·0 cites·11 claims
- 1157US10477701B2Circuit board and method for manufacturing the sameUNIMICRON TECHNOLOGY CORP·Filed 2017·Granted Nov 12, 2019·0 cites·7 claims
- 1250US8979372B2Circuit board and manufacturing method thereof and electro-optic apparatus having the circuit boardUNIMICRON TECHNOLOGY CORP·Filed 2013·Granted Mar 17, 2015·0 cites·15 claims
- 1347US2014099432A1Fabrication method for flexible circuit boardUNIMICRON TECHNOLOGY CORP·Filed 2012·Application pending·0 cites
- 1442US2010266752A1Method for forming circuit board structure of composite materialTSENG TZYY-JANG·Filed 2010·Application pending·0 cites
- 1542US2012031651A1Circuit boardTSENG TZYY-JANG·Filed 2010·Application pending·0 cites
- 1641US8247705B2Circuit substrate and manufacturing method thereofTSENG TZYY-JANG·Filed 2010·Granted Aug 21, 2012·0 cites·19 claims
- 1739US8274798B2Carrier substrate and method for making the sameHUANG SHIH-JUNG·Filed 2010·Granted Sep 25, 2012·0 cites·9 claims
- 1839US8161638B2Manufacturing method of circuit structureTSENG TZYY-JANG·Filed 2010·Granted Apr 24, 2012·0 cites·20 claims
- 1935US8318411B2Method for fabricating an interposerLEE CHANG-MING·Filed 2010·Granted Nov 27, 2012·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →