Inventor · disambiguated record
Yu-Shan Hu
Also filed as: HU YU · HU YU-SHAN
20 granted patents·16 pending applications·313 citations·filing 2004–2024
94Inventor score
Top patents by PatentIndex Score
36 records- 0196US8709865B2Fabrication method of packaging substrate having through-holed interposer embedded thereinHU YU-SHAN·Filed 2012·Granted Apr 29, 2014·43 cites·12 claims
- 0296US8269337B2Packaging substrate having through-holed interposer embedded therein and fabrication method thereofHU YU-SHAN·Filed 2011·Granted Sep 18, 2012·43 cites·11 claims
- 0396US7251079B2Brightness enhancement film, and methods of making and using the sameGEN ELECTRIC·Filed 2006·Granted Jul 31, 2007·165 cites·25 claims
- 0493US7534632B2Method for circuits inspection and method of the sameADVANCED CHIP ENG TECH INC·Filed 2007·Granted May 19, 2009·28 cites·15 claims
- 0584US8513796B2Package structure, fabricating method thereof, and package-on-package device therebyTSENG TZYY-JANG·Filed 2012·Granted Aug 20, 2013·6 cites·12 claims
- 0683US8304923B2Chip packaging structureHU DYI-CHUNG·Filed 2007·Granted Nov 6, 2012·11 cites·15 claims
- 0774US8624366B2Semiconductor package structure and method of fabricating the sameTSENG TZYY-JANG·Filed 2012·Granted Jan 7, 2014·3 cites·5 claims
- 0872US8058102B2Package structure and manufacturing method thereofLIN DIANN-FANG·Filed 2009·Granted Nov 15, 2011·5 cites·7 claims
- 0969US8637402B2Conductive line structure and the method of forming the sameHU YU-SHAN·Filed 2011·Granted Jan 28, 2014·2 cites·11 claims
- 1065US9892988B2Semiconductor packaging structure and manufacturing method for the sameDAWNING LEADING TECH INC·Filed 2014·Granted Feb 13, 2018·2 cites·15 claims
- 1161US9478512B2Semiconductor packaging structure having stacked seed layersDAWNING LEADING TECH INC·Filed 2015·Granted Oct 25, 2016·1 cites·9 claims
- 1258US12099078B2Probe card and wafer testing assembly thereofMPI CORP·Filed 2022·Granted Sep 24, 2024·0 cites·19 claims
- 1357US7341784B2Light management film and its preparation and useGEN ELECTRIC·Filed 2004·Granted Mar 11, 2008·3 cites·32 claims
- 1454US11981604B2Concrete crack repair material based on nano materials and its preparation methodUNIV NINGBO TECHNOLOGY·Filed 2023·Granted May 14, 2024·0 cites·4 claims
- 1553US7339664B2System and method for inspecting a light-management film and method of making the light-management filmGEN ELECTRIC·Filed 2004·Granted Mar 4, 2008·1 cites·9 claims
- 1652US9111948B2Method of fabricating semiconductor package structureUNIMICRON TECHNOLOGY CORP·Filed 2013·Granted Aug 18, 2015·0 cites·8 claims
- 1752US8633061B2Method of fabricating package structureUNIMICRON TECHNOLOGY CORP·Filed 2013·Granted Jan 21, 2014·0 cites·8 claims
- 1852US2010109156A1Back side protective structure for a semiconductor packageADVANCED CHIP ENG TECH INC·Filed 2008·Application pending·0 cites
- 1951US11999661B2Interface joint material based on industrial solid waste and its preparationUNIV NINGBO TECHNOLOGY·Filed 2023·Granted Jun 4, 2024·0 cites·4 claims
- 2051US2024361355A1Membrane probe card, method of making the same and method of making tested semiconductor chip by using the sameMPI CORP·Filed 2024·Application pending·0 cites
- 2150US2009184425A1Conductive line structure and the method of forming the sameADVANCED CHIP ENG TECH INC·Filed 2008·Application pending·0 cites
- 2247US11839020B2Trace embedded probe deviceMPI CORP·Filed 2022·Granted Dec 5, 2023·0 cites·14 claims
- 2347US8749048B2Package structureLIN DIANN-FANG·Filed 2011·Granted Jun 10, 2014·0 cites·13 claims
- 2447US2012061830A1Back side protective structure for a semiconductor packageHU YU-SHAN·Filed 2011·Application pending·0 cites
- 2546US2011031607A1Conductor package structure and method of the sameADVANCED CHIP ENG TECH INC·Filed 2009·Application pending·0 cites
- 2646US2010007017A1Inter-connecting structure for semiconductor package and method for the sameADVANCED CHIP ENG TECH INC·Filed 2008·Application pending·0 cites
- 2745US2007013100A1Method for producing plastic filmCAPALDO KEVIN P·Filed 2005·Application pending·0 cites
- 2845US2007037960A1Copolyester stilbene embossed film and methods of making the sameGEN ELECTRIC·Filed 2006·Application pending·0 cites
- 2944US2022349919A1Probe installation circuit board and probe device for probe cardMPI CORP·Filed 2022·Application pending·0 cites
- 3043US2007240585A1Embossing system, methods of use, and articles produced therefromVAISH NITIN·Filed 2006·Application pending·0 cites
- 3140US2006056031A1Brightness enhancement film, and methods of making and using the sameCAPALDO KEVIN P·Filed 2004·Application pending·0 cites
- 3240US2007240813A1Process for forming a multilayer film and the film formed therefromHU YU·Filed 2006·Application pending·0 cites
- 3339US2012217627A1Package structure and method of fabricating the sameTSENG TZYY-JANG·Filed 2011·Application pending·0 cites
- 3437US2011209908A1Conductor package structure and method of the sameADVANCED CHIP ENG TECH INC·Filed 2010·Application pending·0 cites
- 3536US2011180891A1Conductor package structure and method of the sameADVANCED CHIP ENG TECH INC·Filed 2010·Application pending·0 cites
- 3636US2011031594A1Conductor package structure and method of the sameADVANCED CHIP ENG TECH INC·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →