Inventor · disambiguated record
Yang Liang Poh
Also filed as: POH YANG LIANG
5 granted patents·0 citations·filing 2019–2021
59Inventor score
Technology areasH10W
Files withINTEL CORP5
Top patents by PatentIndex Score
5 records- 0162US11887917B2Encapsulated vertical interconnects for high-speed applications and methods of assembling sameINTEL CORP·Filed 2021·Granted Jan 30, 2024·0 cites·14 claims
- 0257US12191281B2Multi-chip package with recessed memoryINTEL CORP·Filed 2021·Granted Jan 7, 2025·0 cites·20 claims
- 0354US11049801B2Encapsulated vertical interconnects for high-speed applications and methods of assembling sameINTEL CORP·Filed 2019·Granted Jun 29, 2021·0 cites·21 claims
- 0453US11545434B2Vertical die-to-die interconnects bridgeINTEL CORP·Filed 2020·Granted Jan 3, 2023·0 cites·17 claims
- 0536US11456516B2Low loss high-speed interconnectsINTEL CORP·Filed 2020·Granted Sep 27, 2022·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →