Inventor · disambiguated record
Hayato Kotani
Also filed as: KOTANI HAYATO
11 granted patents·3 pending applications·32 citations·filing 2007–2016
86Inventor score
Top patents by PatentIndex Score
14 records- 0183US8212271B2Substrate for mounting an optical semiconductor element, manufacturing method thereof, an optical semiconductor device, and manufacturing method thereofKOTANI HAYATO·Filed 2008·Granted Jul 3, 2012·11 cites·13 claims
- 0275US8785525B2Thermosetting light-reflecting resin composition, optical semiconductor element mounting board produced therewith, method for manufacture thereof, and optical semiconductor deviceKOTANI HAYATO·Filed 2008·Granted Jul 22, 2014·7 cites·24 claims
- 0373US8585272B2Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensateKOTANI HAYATO·Filed 2009·Granted Nov 19, 2013·6 cites·3 claims
- 0473US8524921B2Liquid tetracarboxylic dianhydrides and process for the preparation thereofKIKUCHI TOORU·Filed 2009·Granted Sep 3, 2013·2 cites·2 claims
- 0573US8343616B2Coating agent, substrate for mounting optical semiconductor element using same, and optical semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2009·Granted Jan 1, 2013·4 cites·2 claims
- 0670US9387608B2Thermosetting resin composition for light reflection, method for manufacturing the resin composition and optical semiconductor element mounting substrate and optical semiconductor device using the resin compositionKOTANI HAYATO·Filed 2007·Granted Jul 12, 2016·2 cites·20 claims
- 0764US10381533B2Optical semiconductor element mounting substrate and optical semiconductor device using thermosetting resin composition for light reflectionHITACHI CHEMICAL CO LTD·Filed 2016·Granted Aug 13, 2019·0 cites·14 claims
- 0854US9067906B2Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensateHITACHI CHEMICAL CO LTD·Filed 2013·Granted Jun 30, 2015·0 cites·2 claims
- 0951US8367153B2Method of using white resin in an electronic deviceHITACHI CHEMICAL CO LTD·Filed 2011·Granted Feb 5, 2013·0 cites·13 claims
- 1049US8421113B2Electronic device incorporating the white resinURASAKI NAOYUKI·Filed 2011·Granted Apr 16, 2013·0 cites·16 claims
- 1147US2013001622A1Substrate for mounting optical semiconductor element and manufacturing method thereof, optical semiconductor device and manufacturing method for thereofKOTANI HAYATO·Filed 2012·Application pending·0 cites
- 1246US8637593B2Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensateKOTANI HAYATO·Filed 2010·Granted Jan 28, 2014·0 cites·2 claims
- 1339US2011297424A1Wiring board, electronic device package, and methods of production of the sameYOSHIDA HIDEKI·Filed 2010·Application pending·0 cites
- 1436US2012196977A1Urethane resin composition, cured object, and photosemiconductor device using cured objectTOMIYAMA TAKEO·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →