Inventor · disambiguated record
Gary B. Tepolt
Also filed as: TEPOLT GARY B
11 granted patents·1 pending application·212 citations·filing 1988–2016
90Inventor score
Files withCHARLES STARK DRAPER LABORATORY INC3DRAPER LAB CHARLES S3INTEGRATED SOLUTIONS INC2RACZ LIVIA M2MERULLO JOHN G1
Top patents by PatentIndex Score
12 records- 0190US8535984B2Electronic modules and methods for forming the sameRACZ LIVIA M·Filed 2011·Granted Sep 17, 2013·13 cites·12 claims
- 0289US8017451B2Electronic modules and methods for forming the sameDRAPER LAB CHARLES S·Filed 2008·Granted Sep 13, 2011·16 cites·16 claims
- 0388US5746565ARobotic wafer handlerINTEGRATED SOLUTIONS INC·Filed 1996·Granted May 5, 1998·113 cites·20 claims
- 0486US8273603B2Interposers, electronic modules, and methods for forming the sameRACZ LIVIA M·Filed 2009·Granted Sep 25, 2012·17 cites·15 claims
- 0576US7960247B2Die thinning processes and structuresDRAPER LAB CHARLES S·Filed 2008·Granted Jun 14, 2011·5 cites·32 claims
- 0675US5611886AProcess chamber for semiconductor substratesINTEGRATED SOLUTIONS INC·Filed 1995·Granted Mar 18, 1997·37 cites·22 claims
- 0764US7981698B2Removal of integrated circuits from packagesDRAPER LAB CHARLES S·Filed 2007·Granted Jul 19, 2011·4 cites·15 claims
- 0854US9425069B2Electronic modulesCHARLES STARK DRAPER LABORATORY INC·Filed 2013·Granted Aug 23, 2016·0 cites·18 claims
- 0945US2012086135A1Interposers, electronic modules, and methods for forming the sameTHOMPSON JEFFREY C·Filed 2011·Application pending·0 cites
- 1039US10453787B2Method and apparatus for forming multi-layered vias in sequentially fabricated circuitsCHARLES STARK DRAPER LABORATORY INC·Filed 2016·Granted Oct 22, 2019·0 cites·11 claims
- 1137US9693469B2Electronic module subassembliesCHARLES STARK DRAPER LABORATORY INC·Filed 2013·Granted Jun 27, 2017·0 cites·5 claims
- 1224US4850299ASemiconductor wafer coating apparatus with angular oscillation meansMERULLO JOHN G·Filed 1988·Granted Jul 25, 1989·7 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →