Inventor · disambiguated record
Masanori Shindo
Also filed as: SHINDO MASANORI
16 granted patents·4 pending applications·248 citations·filing 1984–2023
92Inventor score
Files withLAPIS SEMICONDUCTOR CO LTD10JAPAN TOBACCO INC5NIPPON POLYURETHANE KOGYO KK2YOSHITOMI PHARMACEUTICAL2SHINAGAWA YUKO1
Top patents by PatentIndex Score
20 records- 0194US5593988ATherapeutic agent for osteoporosis and diazepine compoundYOSHITOMI PHARMACEUTICAL·Filed 1992·Granted Jan 14, 1997·70 cites·7 claims
- 0293US4604418AProcess for isocyanurating hexamethylene-diisocyanate using a sodium or potassium carboxylate catalyst and a paint composition comprising the product of said process and polyolsNIPPON POLYURETHANE KOGYO KK·Filed 1984·Granted Aug 5, 1986·50 cites·23 claims
- 0392US5753649ATherapeutic agent for osteoporosis and diazepine compoundYOSHITOMI PHARMACEUTICAL·Filed 1996·Granted May 19, 1998·65 cites·6 claims
- 0484US7285572B2CaSR antagonistJAPAN TOBACCO INC·Filed 2005·Granted Oct 23, 2007·12 cites·10 claims
- 0581US5354834APolyisocyanate curing agent, and coating composition and adhesive composition employing the sameNIPPON POLYURETHANE KOGYO KK·Filed 1992·Granted Oct 11, 1994·32 cites·21 claims
- 0675US7304174B2CaSR antagonistJAPAN TOBACCO INC·Filed 2004·Granted Dec 4, 2007·8 cites·13 claims
- 0769US12094824B2Semiconductor package and method for manufacturing semiconductor packageLAPIS SEMICONDUCTOR CO LTD·Filed 2023·Granted Sep 17, 2024·0 cites·3 claims
- 0865US11545452B2Semiconductor device bonding area including fused solder film and manufacturing methodLAPIS SEMICONDUCTOR CO LTD·Filed 2020·Granted Jan 3, 2023·0 cites·4 claims
- 0964US11742305B2Semiconductor device and manufacturing method of semiconductor deviceLAPIS SEMICONDUCTOR CO LTD·Filed 2021·Granted Aug 29, 2023·0 cites·8 claims
- 1063US2009326058A1CaSR AntagonistJAPAN TOBACCO INC·Filed 2009·Application pending·0 cites
- 1162US5807850ATherapeutic agent for osteoporosis and triazepine compoundJAPAN TOBACCO INC·Filed 1995·Granted Sep 15, 1998·11 cites·32 claims
- 1260US11538775B2Semiconductor device and method of manufacturing a semiconductor deviceLAPIS SEMICONDUCTOR CO LTD·Filed 2021·Granted Dec 27, 2022·0 cites·19 claims
- 1359US11664314B2Semiconductor package and method for manufacturing semiconductor packageLAPIS SEMICONDUCTOR CO LTD·Filed 2020·Granted May 30, 2023·0 cites·1 claims
- 1459US2008255042A1CaSR AntagonistJAPAN TOBACCO INC·Filed 2007·Application pending·0 cites
- 1556US11600589B2Semiconductor device and semiconductor device manufacturing methodLAPIS SEMICONDUCTOR CO LTD·Filed 2021·Granted Mar 7, 2023·0 cites·9 claims
- 1655US11004813B2Semiconductor device and manufacturing method of semiconductor deviceLAPIS SEMICONDUCTOR CO LTD·Filed 2018·Granted May 11, 2021·0 cites·18 claims
- 1754US10910331B2Semiconductor device bonding area including fused solder film and manufacturing methodLAPIS SEMICONDUCTOR CO LTD·Filed 2018·Granted Feb 2, 2021·0 cites·8 claims
- 1854US2023094425A1Semiconductor device and semiconductor device fabrication methodLAPIS SEMICONDUCTOR CO LTD·Filed 2022·Application pending·0 cites
- 1952US2012301552A1CaSR AntagonistSHINAGAWA YUKO·Filed 2011·Application pending·0 cites
- 2047US10141279B2Semiconductor device and manufacturing method for semiconductor deviceLAPIS SEMICONDUCTOR CO LTD·Filed 2017·Granted Nov 27, 2018·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →