Inventor · disambiguated record
Seiko Minami
Also filed as: MINAMI SEIKO
13 granted patents·4 pending applications·26 citations·filing 1992–2024
85Inventor score
Top patents by PatentIndex Score
17 records- 0186US11020971B2Liquid ejection headCANON KK·Filed 2019·Granted Jun 1, 2021·2 cites·13 claims
- 0276US9102151B2Liquid ejection head and method for producing the sameCANON KK·Filed 2014·Granted Aug 11, 2015·2 cites·11 claims
- 0375US8007074B2Liquid discharge recording headCANON KK·Filed 2010·Granted Aug 30, 2011·2 cites·9 claims
- 0475US5288902AMethod of manufacturing ferulic acidTSUNO FOOD IND CO LTD·Filed 1992·Granted Feb 22, 1994·19 cites·11 claims
- 0567US12138928B2Method for manufacturing liquid ejection head substrate and method for manufacturing liquid ejection headCANON KK·Filed 2022·Granted Nov 12, 2024·0 cites·12 claims
- 0665US11833817B2Liquid ejection head substrate and liquid ejection headCANON KK·Filed 2021·Granted Dec 5, 2023·0 cites·17 claims
- 0765US11760090B2Liquid ejection head circuit board and liquid ejection headCANON KK·Filed 2021·Granted Sep 19, 2023·0 cites·12 claims
- 0860US2025196492A1Recording device and control method thereofCANON KK·Filed 2024·Application pending·0 cites
- 0959US8241540B2Method of manufacturing liquid discharge headWATANABE MASAHISA·Filed 2009·Granted Aug 14, 2012·1 cites·7 claims
- 1056US2024227394A1Head board, liquid discharge head, and liquid discharge apparatusCANON KK·Filed 2024·Application pending·0 cites
- 1154US2015136024A1Liquid discharge headCANON KK·Filed 2013·Application pending·0 cites
- 1251US9511588B2Method for processing silicon substrateCANON KK·Filed 2014·Granted Dec 6, 2016·0 cites·17 claims
- 1347US8361815B2Substrate processing method and method for manufacturing liquid ejection headCANON KK·Filed 2011·Granted Jan 29, 2013·0 cites·11 claims
- 1445US9371225B2Substrate processing methodCANON KK·Filed 2014·Granted Jun 21, 2016·0 cites·8 claims
- 1540US2019263124A1Liquid ejection head substrate and method for producing liquid ejection head substrateCANON KK·Filed 2019·Application pending·0 cites
- 1639US9789689B2Method of forming through-substrateCANON KK·Filed 2015·Granted Oct 17, 2017·0 cites·14 claims
- 1735US9676193B2Substrate processing method and method of manufacturing substrate for liquid discharge head including forming hole in substrate by dry etchingCANON KK·Filed 2015·Granted Jun 13, 2017·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →