Inventor · disambiguated record
Philippe Chantraine
Also filed as: CHANTRAINE PHILIPPE
5 granted patents·96 citations·filing 1986–1990
82Inventor score
Files withBULL SA5
Top patents by PatentIndex Score
5 records- 0156US4826786AMethod for forming a multilayered metal network for bonding components of a high-density integrated circuit, and integrated circuit produced therebyBULL SA·Filed 1986·Granted May 2, 1989·24 cites·9 claims
- 0255US4906592AMethod for forming a multilayered metal network for bonding components of a high-density integrated circuit using a spin on glass layerBULL SA·Filed 1989·Granted Mar 6, 1990·22 cites·12 claims
- 0352US5464653AMethod for interconnection of metal layers of the multilayer network of an electronic board, and the resultant boardBULL SA·Filed 1990·Granted Nov 7, 1995·22 cites·16 claims
- 0443US5231757AMethod for forming the multi-layer structure of a connection board of at least one very large scale integrated circuitBULL SA·Filed 1990·Granted Aug 3, 1993·16 cites·6 claims
- 0543US5082718AMethod for depositing an insulating layer on a conductive layer of a multi-layer connection board of one very large scale integrated circuitBULL SA·Filed 1990·Granted Jan 21, 1992·12 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →