Inventor · disambiguated record
Teruaki Kumazawa
Also filed as: KUMAZAWA TERUAKI
5 granted patents·5 pending applications·10 citations·filing 2016–2025
66Inventor score
Top patents by PatentIndex Score
10 records- 0194US11881407B2Processed wafer and method of manufacturing chip formation waferDENSO CORP·Filed 2021·Granted Jan 23, 2024·10 cites·5 claims
- 0271US2025336726A1Manufacturing method of semiconductor deviceDENSO CORP·Filed 2025·Application pending·0 cites
- 0365US12424496B2Manufacturing method of semiconductor deviceDENSO CORP·Filed 2022·Granted Sep 23, 2025·0 cites·6 claims
- 0453US12426329B2Silicon carbide semiconductor device including a side silicide layer and method for manufacturing the sameDENSO CORP·Filed 2022·Granted Sep 23, 2025·0 cites·10 claims
- 0552US2024038711A1Semiconductor device and manufacturing method of semiconductor deviceDENSO CORP·Filed 2023·Application pending·0 cites
- 0650US11387372B2Semiconductor deviceDENSO CORP·Filed 2020·Granted Jul 12, 2022·0 cites·5 claims
- 0747US2023178497A1Semiconductor device and method for manufacturing the sameDENSO CORP·Filed 2022·Application pending·0 cites
- 0845US2025293094A1Method for manufacturing semiconductor deviceDENSO CORP·Filed 2025·Application pending·0 cites
- 0939US10177236B2Method of manufacturing semiconductor deviceTOYOTA MOTOR CO LTD·Filed 2017·Granted Jan 8, 2019·0 cites·7 claims
- 1034US2018286974A1Semiconductor device and manufacturing method thereofTOYOTA MOTOR CO LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →