Inventor · disambiguated record
Lu-Yi Chen
Also filed as: CHEN LU · CHEN LU-YI
27 granted patents·5 pending applications·155 citations·filing 2000–2020
95Inventor score
Top patents by PatentIndex Score
32 records- 0190US9515039B2Substrate structure with first and second conductive bumps having different widthsSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Dec 6, 2016·8 cites·10 claims
- 0287US6430070B1Synchronous PWM switching regulator systemWINBOND ELECTRONICS CORP·Filed 2001·Granted Aug 6, 2002·67 cites·5 claims
- 0376US9997481B2Semiconductor package with stacked semiconductor chipsSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2012·Granted Jun 12, 2018·3 cites·19 claims
- 0475US9818635B2Carrier structure, packaging substrate, electronic package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Nov 14, 2017·2 cites·11 claims
- 0573US9601403B2Electronic package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Mar 21, 2017·2 cites·19 claims
- 0672US10622323B2Fabrication method of semiconductor package with stacked semiconductor chipsSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Granted Apr 14, 2020·1 cites·14 claims
- 0770US10796970B2Method for fabricating electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Granted Oct 6, 2020·1 cites·9 claims
- 0867US11101235B2Fabrication method of semiconductor package with stacked semiconductor chipsSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Aug 24, 2021·0 cites·35 claims
- 0967US9991178B2Interposer and electrical testing method thereofChen lu yi·Filed 2012·Granted Jun 5, 2018·2 cites·8 claims
- 1066US10128178B2Electronic package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Nov 13, 2018·1 cites·8 claims
- 1166US9269602B2Fabrication method of wafer level semiconductor package and fabrication method of wafer level packaging substrateSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2012·Granted Feb 23, 2016·2 cites·20 claims
- 1266US6320427B1High-speed, low-power continuous-time CMOS current comparatorWINBOND ELECTRONICS CORP·Filed 2000·Granted Nov 20, 2001·13 cites·20 claims
- 1365US10141233B2Electronic package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Nov 27, 2018·1 cites·9 claims
- 1463US6876989B2Back-propagation neural network with enhanced neuron characteristicsWINBOND ELECTRONICS CORP·Filed 2002·Granted Apr 5, 2005·11 cites·25 claims
- 1562US6480367B2Dual-switching and dual-linear power controller chipWINBOND ELECTRONICS CORP·Filed 2001·Granted Nov 12, 2002·15 cites·8 claims
- 1660US6583520B2Dual-switching and dual-linear power controller chipWINBOND ELECTRONICS CORP·Filed 2002·Granted Jun 24, 2003·13 cites·8 claims
- 1755US9735075B2Electronic module and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Aug 15, 2017·0 cites·9 claims
- 1854US10950507B2Electrical testing method of interposerSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Granted Mar 16, 2021·0 cites·12 claims
- 1954US6809558B1Push-pull output neuron circuitWINBOND ELECTRONICS CORP·Filed 2003·Granted Oct 26, 2004·4 cites·19 claims
- 2053US10403570B2Method for fabricating electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Granted Sep 3, 2019·0 cites·9 claims
- 2153US6946894B2Current-mode synapse multiplier circuitWINBOND ELECTRONICS CORP·Filed 2003·Granted Sep 20, 2005·4 cites·1 claims
- 2252US10461002B2Fabrication method of electronic moduleSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Oct 29, 2019·0 cites·11 claims
- 2352US10211082B2Fabrication method of electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Feb 19, 2019·0 cites·9 claims
- 2449US6664818B1Current controlled sigmoid neural circuitWINBOND ELECTRONICS CORP·Filed 2002·Granted Dec 16, 2003·1 cites·10 claims
- 2549US2015035164A1Semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 2647US7035835B2High-precision current-mode pulse-width-modulation circuitWINBOND ELECTRONICS CORP·Filed 2003·Granted Apr 25, 2006·4 cites·24 claims
- 2746US2017148761A1Method of fabricating semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Application pending·0 cites
- 2844US10201086B2Electronic deviceSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Feb 5, 2019·0 cites·6 claims
- 2941US2004083193A1Expandable on-chip back propagation learning neural network with 4-neuron 16-synapseFiled 2002·Application pending·0 cites
- 3041US2015035163A1Semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 3140US2003220889A1Analog accumulator for neural networksFiled 2002·Application pending·0 cites
- 3237US10242972B2Package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Mar 26, 2019·0 cites·27 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →