Inventor · disambiguated record
Chytra Pawashe
Also filed as: PAWASHE CHYTRA
13 granted patents·3 pending applications·16 citations·filing 2013–2022
85Inventor score
Top patents by PatentIndex Score
16 records- 0185US11056356B1Fluid viscosity control during wafer bondingINTEL CORP·Filed 2018·Granted Jul 6, 2021·5 cites·9 claims
- 0282US10242892B2Micro pick and bond assemblyINTEL CORP·Filed 2014·Granted Mar 26, 2019·5 cites·19 claims
- 0380US10720345B1Wafer to wafer bonding with low wafer distortionINTEL CORP·Filed 2018·Granted Jul 21, 2020·3 cites·13 claims
- 0476US11721554B2Stress compensation for wafer to wafer bondingINTEL CORP·Filed 2019·Granted Aug 8, 2023·2 cites·16 claims
- 0570US10886153B2Display including an LED element having a pressure sensitive adhesive (PSA) for micro pick and bond assembly of the displayINTEL CORP·Filed 2018·Granted Jan 5, 2021·1 cites·17 claims
- 0658US9947805B2Nanowire-based mechanical switching deviceINTEL CORP·Filed 2016·Granted Apr 17, 2018·0 cites·19 claims
- 0751US2023367204A1System and method for reducing pellicle ruptureINTEL CORP·Filed 2022·Application pending·0 cites
- 0850US11195719B2Reducing in-plane distortion from wafer to wafer bonding using a dummy waferINTEL CORP·Filed 2018·Granted Dec 7, 2021·0 cites·15 claims
- 0950US2024063143A1Device, method, and system to mitigate warpage of a composite chipletINTEL CORP·Filed 2022·Application pending·0 cites
- 1048US9362074B2Nanowire-based mechanical switching devicePAWASHE CHYTRA·Filed 2013·Granted Jun 7, 2016·0 cites·24 claims
- 1146US10282965B2Synthetic jet delivering controlled flow to sensor systemINTEL CORP·Filed 2014·Granted May 7, 2019·0 cites·25 claims
- 1246US9926193B2Magnetic nanomechanical devices for stiction compensationINTEL CORP·Filed 2014·Granted Mar 27, 2018·0 cites·26 claims
- 1344US11171057B2Semiconductor fin design to mitigate fin collapseINTEL CORP·Filed 2016·Granted Nov 9, 2021·0 cites·20 claims
- 1444US10707186B1Compliant layer for wafer to wafer bondingINTEL CORP·Filed 2018·Granted Jul 7, 2020·0 cites·8 claims
- 1543US10457548B2Integrating MEMS structures with interconnects and viasINTEL CORP·Filed 2015·Granted Oct 29, 2019·0 cites·21 claims
- 1642US2022415807A1Thermal management structures in semiconductor devices and methods of fabricationINTEL CORP·Filed 2021·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Chytra Pawashe files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →