Inventor · disambiguated record
Alexander J. Elliott
Also filed as: ELLIOTT ALEXANDER J · ELLIOTT ALEXANDER JAMES
14 granted patents·1 pending application·208 citations·filing 1991–2013
93Inventor score
Files withFREESCALE SEMICONDUCTOR INC7MOTOROLA INC6ELLIOTT ALEXANDER J1SEMICONDUCTOR COMPONENTS IND LLC1
Top patents by PatentIndex Score
15 records- 0192US7445967B2Method of packaging a semiconductor die and package thereofFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Nov 4, 2008·23 cites·20 claims
- 0279US6870243B2Thin GaAs die with copper back-metal structureFREESCALE SEMICONDUCTOR INC·Filed 2002·Granted Mar 22, 2005·26 cites·17 claims
- 0379US5614131AMethod of making an optoelectronic deviceMOTOROLA INC·Filed 1995·Granted Mar 25, 1997·71 cites·14 claims
- 0472US7092890B2Method for manufacturing thin GaAs die with copper-back metal structuresFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Aug 15, 2006·5 cites·20 claims
- 0569US7091602B2Miniature moldlocks for heatsink or flag for an overmolded plastic packageFREESCALE SEMICONDUCTOR INC·Filed 2002·Granted Aug 15, 2006·14 cites·19 claims
- 0661US9799627B2Semiconductor package structure and methodSEMICONDUCTOR COMPONENTS IND LLC·Filed 2013·Granted Oct 24, 2017·1 cites·25 claims
- 0755US5074139ARoll forming of semiconductor component leadframesMOTOROLA INC·Filed 1991·Granted Dec 24, 1991·23 cites·7 claims
- 0854US6982483B2High impedance radio frequency power plastic packageFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Jan 3, 2006·7 cites·23 claims
- 0951US8310042B2Heatsink moldlocksELLIOTT ALEXANDER J·Filed 2006·Granted Nov 13, 2012·1 cites·5 claims
- 1051US2009023248A1Method of packaging a semiconductor dieFREESCALE SEMICONDUCTOR INC·Filed 2008·Application pending·0 cites
- 1146US5175007AMold assembly with separate encapsulating cavitiesMOTOROLA INC·Filed 1991·Granted Dec 29, 1992·16 cites·4 claims
- 1242US6996897B2Method of making a mount for electronic devicesFREESCALE SEMICONDUCTOR INC·Filed 2002·Granted Feb 14, 2006·1 cites·12 claims
- 1338US6147410AElectronic component and method of manufactureMOTOROLA INC·Filed 1998·Granted Nov 14, 2000·10 cites·18 claims
- 1438US5786745AElectronic package and methodMOTOROLA INC·Filed 1996·Granted Jul 28, 1998·8 cites·7 claims
- 1530US5075255AMethod of removing contaminants from a plated article with a clean burning hydrogen flameMOTOROLA INC·Filed 1991·Granted Dec 24, 1991·2 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →