Inventor · disambiguated record
Lori A. Dicks
Also filed as: DICKS LORI A
11 granted patents·366 citations·filing 1988–1991
93Inventor score
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11 records- 0188US5066614AMethod of manufacturing a leadframe having conductive elements preformed with solder bumpsHONEYWELL INC·Filed 1990·Granted Nov 19, 1991·102 cites·9 claims
- 0273US4892245AControlled compression furnace bondingHONEYWELL INC·Filed 1988·Granted Jan 9, 1990·50 cites·19 claims
- 0371US5099306AStacked tab leadframe assemblyHONEYWELL INC·Filed 1991·Granted Mar 24, 1992·47 cites·45 claims
- 0470US4898320AMethod of manufacturing a high-yield solder bumped semiconductor waferHONEYWELL INC·Filed 1988·Granted Feb 6, 1990·35 cites·17 claims
- 0561US4948032AFluxing agentATMEL CORP·Filed 1988·Granted Aug 14, 1990·24 cites·12 claims
- 0660US5010387ASolder bonding materialHONEYWELL INC·Filed 1988·Granted Apr 23, 1991·15 cites·14 claims
- 0760US4980753ALow-cost high-performance semiconductor chip packageHONEYWELL INC·Filed 1988·Granted Dec 25, 1990·25 cites·26 claims
- 0858US4979289AMethod of die bonding semiconductor chip by using removable non-wettable by solder frameHONEYWELL INC·Filed 1989·Granted Dec 25, 1990·23 cites·8 claims
- 0955US5161729APackage to semiconductor chip active interconnect site methodHONEYWELL INC·Filed 1991·Granted Nov 10, 1992·23 cites·3 claims
- 1045US5074036AMethod of die bonding semiconductor chip by using removable frameHONEYWELL INC·Filed 1990·Granted Dec 24, 1991·15 cites·6 claims
- 1136US5101550ARemovable drop-through die bond frameHONEYWELL INC·Filed 1991·Granted Apr 7, 1992·7 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →