Inventor · disambiguated record
Thomas J. Dunaway
Also filed as: DUNAWAY THOMAS J
24 granted patents·718 citations·filing 1982–1997
97Inventor score
Top patents by PatentIndex Score
24 records- 0188US5066614AMethod of manufacturing a leadframe having conductive elements preformed with solder bumpsHONEYWELL INC·Filed 1990·Granted Nov 19, 1991·102 cites·9 claims
- 0281US5066831AUniversal semiconductor chip packageHONEYWELL INC·Filed 1989·Granted Nov 19, 1991·55 cites·14 claims
- 0373US5891745ATest and tear-away bond pad designHONEYWELL INC·Filed 1997·Granted Apr 6, 1999·44 cites·16 claims
- 0473US4892245AControlled compression furnace bondingHONEYWELL INC·Filed 1988·Granted Jan 9, 1990·50 cites·19 claims
- 0572US5140496ADirect microcircuit decouplingHONEYWELL INC·Filed 1991·Granted Aug 18, 1992·48 cites·12 claims
- 0671US5099306AStacked tab leadframe assemblyHONEYWELL INC·Filed 1991·Granted Mar 24, 1992·47 cites·45 claims
- 0770US4898320AMethod of manufacturing a high-yield solder bumped semiconductor waferHONEYWELL INC·Filed 1988·Granted Feb 6, 1990·35 cites·17 claims
- 0867US5498900ASemiconductor package with weldable ceramic lidHONEYWELL INC·Filed 1993·Granted Mar 12, 1996·36 cites·4 claims
- 0964US5874319AVacuum die bond for known good die assemblyHONEYWELL INC·Filed 1996·Granted Feb 23, 1999·28 cites·4 claims
- 1064US5036163AUniversal semiconductor chip packageHONEYWELL INC·Filed 1990·Granted Jul 30, 1991·34 cites·6 claims
- 1161US4948032AFluxing agentATMEL CORP·Filed 1988·Granted Aug 14, 1990·24 cites·12 claims
- 1260US5010387ASolder bonding materialHONEYWELL INC·Filed 1988·Granted Apr 23, 1991·15 cites·14 claims
- 1360US4980753ALow-cost high-performance semiconductor chip packageHONEYWELL INC·Filed 1988·Granted Dec 25, 1990·25 cites·26 claims
- 1458US4979289AMethod of die bonding semiconductor chip by using removable non-wettable by solder frameHONEYWELL INC·Filed 1989·Granted Dec 25, 1990·23 cites·8 claims
- 1557US4999700APackage to board variable pitch tabHONEYWELL INC·Filed 1989·Granted Mar 12, 1991·22 cites·2 claims
- 1656US5139610AMethod of making a surface etched shadow maskHONEYWELL INC·Filed 1990·Granted Aug 18, 1992·26 cites·14 claims
- 1755US5161729APackage to semiconductor chip active interconnect site methodHONEYWELL INC·Filed 1991·Granted Nov 10, 1992·23 cites·3 claims
- 1854US4528446AOptoelectronic lens array with an integrated circuitHONEYWELL INC·Filed 1982·Granted Jul 9, 1985·15 cites·22 claims
- 1951US6611054B1IC package lid for dose enhancement protectionHONEYWELL INC·Filed 1993·Granted Aug 26, 2003·18 cites·12 claims
- 2049US5719748ASemiconductor package with a bridge for chip area connectionHONEYWELL INC·Filed 1995·Granted Feb 17, 1998·17 cites·10 claims
- 2145US5074036AMethod of die bonding semiconductor chip by using removable frameHONEYWELL INC·Filed 1990·Granted Dec 24, 1991·15 cites·6 claims
- 2236US5101550ARemovable drop-through die bond frameHONEYWELL INC·Filed 1991·Granted Apr 7, 1992·7 cites·8 claims
- 2334US4980240ASurface etched shadow maskHONEYWELL INC·Filed 1989·Granted Dec 25, 1990·5 cites·4 claims
- 2431US5773311AMethod for providing a test connection and a permanent connection site on an unpackaged semiconductor dieHONEYWELL INC·Filed 1996·Granted Jun 30, 1998·4 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →