Inventor · disambiguated record
Casey J. Grant
Also filed as: GRANT CASEY J · GRANT CASEY JON
14 granted patents·1 pending application·99 citations·filing 2000–2012
91Inventor score
Top patents by PatentIndex Score
15 records- 0191US6776171B2Cleaning of semiconductor wafers by contaminate encapsulationIBM·Filed 2001·Granted Aug 17, 2004·43 cites·7 claims
- 0283US7773159B2Switching system for signal monitoring and switch-back controlIBM·Filed 2006·Granted Aug 10, 2010·9 cites·20 claims
- 0376US7872692B2Structure for switching system for signal monitoring and switch-back controlIBM·Filed 2008·Granted Jan 18, 2011·5 cites·12 claims
- 0472US8129095B2Methods, photomasks and methods of fabricating photomasks for improving damascene wire uniformity without reducing performanceGRANT CASEY JON·Filed 2009·Granted Mar 6, 2012·6 cites·13 claims
- 0570US8399181B2Methods of fabricating photomasks for improving damascene wire uniformity without reducing performanceGRANT CASEY J·Filed 2012·Granted Mar 19, 2013·3 cites·18 claims
- 0670US6670283B2Backside protection filmsIBM·Filed 2001·Granted Dec 30, 2003·15 cites·20 claims
- 0763US6992014B2Method and apparatus for etch rate uniformity controlIBM·Filed 2002·Granted Jan 31, 2006·10 cites·14 claims
- 0862US8849440B2Manufacturing control based on a final design structure incorporating both layout and client-specific manufacturing informationGRANT CASEY J·Filed 2012·Granted Sep 30, 2014·2 cites·18 claims
- 0958US9230725B2Methods of designing an inductor having opening enclosed within conductive lineERTURK METE·Filed 2012·Granted Jan 5, 2016·1 cites·8 claims
- 1055US8193893B2Inductor having opening enclosed within conductive line and related methodERTURK METE·Filed 2008·Granted Jun 5, 2012·1 cites·18 claims
- 1146US6884722B2Method of fabricating a narrow polysilicon lineIBM·Filed 2001·Granted Apr 26, 2005·1 cites·19 claims
- 1246US2007117404A1Modification of electrical properties for semiconductor wafersGRANT CASEY J·Filed 2007·Application pending·0 cites
- 1345US7531059B2Cleaning of semiconductor wafers by contaminate encapsulationIBM·Filed 2004·Granted May 12, 2009·0 cites·5 claims
- 1445US6939408B1Method for surface preparation of workpieces utilizing fluid separation techniquesIBM·Filed 2000·Granted Sep 6, 2005·3 cites·4 claims
- 1542US7205216B2Modification of electrical properties for semiconductor wafersIBM·Filed 2004·Granted Apr 17, 2007·0 cites·29 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →