Inventor · disambiguated record
Kyung-Tae Jang
Also filed as: JANG KYUNG-TAE
12 granted patents·5 pending applications·126 citations·filing 2002–2024
91Inventor score
Files withSAMSUNG ELECTRONICS CO LTD8JANG KYUNG-TAE3SAMSUNG KWANGJU ELECTRONICS CO2HAN TAE-JONG1IM JIWOON1
Top patents by PatentIndex Score
17 records- 0192US8415674B2Semiconductor device and method of forming the sameLIM TAI-SOO·Filed 2010·Granted Apr 9, 2013·22 cites·14 claims
- 0291US8643084B2Vertical non-volatile memory deviceSHIN SEUNG-MOK·Filed 2011·Granted Feb 4, 2014·25 cites·15 claims
- 0390US9343475B2Vertical memory devices and methods of manufacturing the sameJANG KYUNG-TAE·Filed 2014·Granted May 17, 2016·19 cites·15 claims
- 0490US9312270B2Methods of manufacturing three-dimensional semiconductor memory devicesSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Apr 12, 2016·7 cites·20 claims
- 0590US8916922B2Vertical memory devices and methods of manufacturing the sameJANG KYUNG-TAE·Filed 2012·Granted Dec 23, 2014·13 cites·28 claims
- 0687US9184178B2Vertical memory devices and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Nov 10, 2015·7 cites·17 claims
- 0774US9780113B2Method for fabricating semiconductor device including a first ILD with sloped surface on a stacked structure and a second ILD on the first ILDIM JIWOON·Filed 2015·Granted Oct 3, 2017·4 cites·20 claims
- 0873US6702557B2Valve assembly prohibiting re-expansion of residual fluidSAMSUNG KWANGJU ELECTRONICS CO·Filed 2002·Granted Mar 9, 2004·15 cites·20 claims
- 0968US6755630B2Apparatus for compressing fluidSAMSUNG KWANGJU ELECTRONICS CO·Filed 2002·Granted Jun 29, 2004·11 cites·19 claims
- 1062US8440531B2Methods of forming semiconductor memory devices having vertically stacked memory cells thereinHAN TAE-JONG·Filed 2012·Granted May 14, 2013·3 cites·20 claims
- 1156US2025227930A1Semiconductor devices, electronic systems including the same, and manufacturing methods thereofSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1253US8691682B2Semiconductor device and method for forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Apr 8, 2014·0 cites·14 claims
- 1347US2008111198A1Stacked semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 1444US2012064682A1Methods of Manufacturing Three-Dimensional Semiconductor Memory DevicesJANG KYUNG-TAE·Filed 2011·Application pending·0 cites
- 1543US2011101467A1Stacked semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2011·Application pending·0 cites
- 1638US2006270183A1Isolation structure and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 1737US7585757B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Sep 8, 2009·0 cites·6 claims
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