Inventor · disambiguated record
Rennie Barber
Also filed as: BARBER RENNIE · BARBER RENNIE G
9 granted patents·4 pending applications·268 citations·filing 1993–2004
90Inventor score
Files withLSI LOGIC CORP11
Top patents by PatentIndex Score
13 records- 0195US6837967B1Method and apparatus for cleaning deposited films from the edge of a waferLSI LOGIC CORP·Filed 2002·Granted Jan 4, 2005·107 cites·26 claims
- 0291US6898064B1System and method for optimizing the electrostatic removal of a workpiece from a chuckLSI LOGIC CORP·Filed 2001·Granted May 24, 2005·63 cites·16 claims
- 0387US6849936B1System and method for using film deposition techniques to provide an antenna within an integrated circuit packageLSI LOGIC CORP·Filed 2002·Granted Feb 1, 2005·40 cites·10 claims
- 0484US6874510B2Method to use a laser to perform the edge clean operation on a semiconductor waferLSI LOGIC CORP·Filed 2003·Granted Apr 5, 2005·27 cites·13 claims
- 0561US6627466B1Method and apparatus for detecting backside contamination during fabrication of a semiconductor waferLSI LOGIC CORP·Filed 2002·Granted Sep 30, 2003·6 cites·10 claims
- 0652US5497727ACooling element for a semiconductor fabrication chamberLSI LOGIC CORP·Filed 1993·Granted Mar 12, 1996·13 cites·6 claims
- 0749US6869893B2Laminate low K filmLSI LOGIC CORP·Filed 2002·Granted Mar 22, 2005·2 cites·16 claims
- 0844US2005109369A1Method to use a laser to perform the edge clean operation on a semiconductor waferLSI LOGIC CORP·Filed 2004·Application pending·0 cites
- 0942US6943055B2Method and apparatus for detecting backside contamination during fabrication of a semiconductor waferLSI LOGIC CORP·Filed 2003·Granted Sep 13, 2005·0 cites·6 claims
- 1042US2005093111A1System and method for using film deposition techniques to provide an antenna within an integrated circuit packageLSI LOGIC CORP·Filed 2004·Application pending·0 cites
- 1141US5942038ACooling element for a semiconductor fabrication chamberLSI LOGIC CORP·Filed 1997·Granted Aug 24, 1999·10 cites·20 claims
- 1235US2004248430A1Wafer cooling chuck with direct coupled peltier unitFiled 2003·Application pending·0 cites
- 1330US2003210510A1Dynamic dechuckingFiled 2002·Application pending·0 cites
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