Inventor · disambiguated record

Satya Chillara

Also filed as: CHILLARA SATYA · CHILLARA SATYA N

11 granted patents·996 citations·filing 1994–1995

94Inventor score

Technology areasH10W

Files withNAT SEMICONDUCTOR CORP11

Top patents by PatentIndex Score

11 records

0195US5739581AHigh density integrated circuit package assembly with a heatsink between stacked diesNAT SEMICONDUCTOR CORP·Filed 1995·Granted Apr 14, 1998·226 cites·35 claims
0294US5650659ASemiconductor component package assembly including an integral RF/EMI shieldNAT SEMICONDUCTOR CORP·Filed 1995·Granted Jul 22, 1997·205 cites·14 claims
0390US5627405AIntegrated circuit assembly incorporating an anisotropic elecctrically conductive layerNAT SEMICONDUCTOR CORP·Filed 1995·Granted May 6, 1997·130 cites·9 claims
0489US5648679ATape ball lead integrated circuit packageNAT SEMICONDUCTOR CORP·Filed 1995·Granted Jul 15, 1997·116 cites·14 claims
0585US5705851AThermal ball lead integrated packageNAT SEMICONDUCTOR CORP·Filed 1995·Granted Jan 6, 1998·92 cites·11 claims
0675US5569956AInterposer connecting leadframe and integrated circuitNAT SEMICONDUCTOR CORP·Filed 1995·Granted Oct 29, 1996·51 cites·13 claims
0770US5790378AHigh density integrated circuit package including interposerNAT SEMICONDUCTOR CORP·Filed 1995·Granted Aug 4, 1998·41 cites·23 claims
0870US5498901ALead frame having layered conductive planesNAT SEMICONDUCTOR CORP·Filed 1994·Granted Mar 12, 1996·43 cites·25 claims
0969US6184575B1Ultra-thin composite package for integrated circuitsNAT SEMICONDUCTOR CORP·Filed 1994·Granted Feb 6, 2001·41 cites·14 claims
1060US5569955AHigh density integrated circuit assembly combining leadframe leads with conductive tracesNAT SEMICONDUCTOR CORP·Filed 1995·Granted Oct 29, 1996·26 cites·13 claims
1157US5442230AHigh density integrated circuit assembly combining leadframe leads with conductive tracesNAT SEMICONDUCTOR CORP·Filed 1994·Granted Aug 15, 1995·25 cites·20 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →