Inventor · disambiguated record
Wei-Tao Tsai
Also filed as: TSAI WEI-TAO
3 granted patents·4 pending applications·1 citations·filing 2019–2025
52Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD7
Top patents by PatentIndex Score
7 records- 0177US12230554B2Shield structure for backside through substrate vias (TSVs)TAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 18, 2025·0 cites·20 claims
- 0274US11062977B2Shield structure for backside through substrate vias (TSVs)TAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 13, 2021·1 cites·20 claims
- 0366US11764129B2Method of forming shield structure for backside through substrate vias (TSVS)TAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 19, 2023·0 cites·20 claims
- 0464US2025149407A1Shield structure for backside through substrate vias (tsvs)TAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0559US2025293085A1Semiconductor die packages and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0659US2025391766A1Ultra-thick metal routing structure and forming method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0757US2025233063A1Semiconductor package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →