Inventor · disambiguated record
Jacob Heier
Also filed as: HEIER JACOB
2 granted patents·0 citations·filing 2019–2019
23Inventor score
Technology areasH10K
Files withEMPA EIDGENOESSISCHE MAT & FORSCHUNGSANSTALT1EMPA EIDGENOSSISCHE MATERIALPRUFUNGS- UND FORSCHUNGSANSTALT1
Top patents by PatentIndex Score
2 records- 0149US12069936B2Electronic device and method for slot-die depositing layers of the sameEMPA EIDGENOESSISCHE MAT & FORSCHUNGSANSTALT·Filed 2019·Granted Aug 20, 2024·0 cites·16 claims
- 0244US12033812B2Electronic device and method for producing layers of the sameEMPA Eidgenossische Materialprufungs—und Forschungsanstalt·Filed 2019·Granted Jul 9, 2024·0 cites·22 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →