Inventor · disambiguated record
Khay Chwan Saw
Also filed as: SAW KHAY CHWAN · SAW KHAY CHWAN ANDREW
12 granted patents·5 pending applications·20 citations·filing 2017–2025
84Inventor score
Top patents by PatentIndex Score
17 records- 0193US10796981B1Chip to lead interconnect in encapsulant of molded semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2019·Granted Oct 6, 2020·12 cites·20 claims
- 0276US11133281B2Chip to chip interconnect in encapsulant of molded semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2019·Granted Sep 28, 2021·2 cites·10 claims
- 0376US10741466B2Formation of conductive connection tracks in package mold body using electroless platingINFINEON TECHNOLOGIES AG·Filed 2017·Granted Aug 11, 2020·3 cites·7 claims
- 0475US11296000B2Formation of conductive connection tracks in package mold body using electroless platingINFINEON TECHNOLOGIES AG·Filed 2020·Granted Apr 5, 2022·1 cites·7 claims
- 0567US11569196B2Chip to chip interconnect in encapsulant of molded semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2021·Granted Jan 31, 2023·0 cites·12 claims
- 0665US10325837B2Molded semiconductor package with C-wing and gull-wing leadsINFINEON TECHNOLOGIES AG·Filed 2017·Granted Jun 18, 2019·2 cites·20 claims
- 0765US2023049564A1Semiconductor Package with Lead Tip Inspection FeatureINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 0864US2025266311A1Methods for Manufacturing Semiconductor PackagesINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
- 0959US12300559B2Semiconductor packages and methods for manufacturing thereofINFINEON TECHNOLOGIES AG·Filed 2021·Granted May 13, 2025·0 cites·15 claims
- 1058US11587800B2Semiconductor package with lead tip inspection featureINFINEON TECHNOLOGIES AG·Filed 2020·Granted Feb 21, 2023·0 cites·11 claims
- 1157US2023197585A1Semiconductor package interconnect and power connection by metallized structures on package bodyINFINEON TECHNOLOGIES AG·Filed 2021·Application pending·0 cites
- 1257US2025140734A1Molded power die package with vertical interconnectINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Application pending·0 cites
- 1355US12021000B2Semiconductor package and method for fabricating a semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2021·Granted Jun 25, 2024·0 cites·10 claims
- 1455US11274984B2Pressure sensor having a lidless/laminate structureINFINEON TECHNOLOGIES AG·Filed 2020·Granted Mar 15, 2022·0 cites·16 claims
- 1552US12176222B2Semiconductor package with metal posts from structured leadframeINFINEON TECHNOLOGIES AG·Filed 2021·Granted Dec 24, 2024·0 cites·20 claims
- 1649US12218038B2Leadframe, semiconductor package and methodINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2019·Granted Feb 4, 2025·0 cites·20 claims
- 1749US2022278085A1Method for connecting an electrical device to a bottom unit by using a solderless jointINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →